IP Library Assignment 051635/0199
Patent Assignment
Reel/Frame 051635/0199

Assignment of Assignor's Interest

Recorded: 2020-01-27 Pages: 3
Assignors
UPPAL, AASTHA
Executed: 2020-01-16
CHANG, JE-YOUNG
Executed: 2020-01-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Integrated Circuit Assemblies Having Metal Foam Structures
Application: 16/750,213 →
Publication: US 2021/0233832