Method of controlling the placement of micro-objects on a micro-assembler
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
1. A method, comprising:
detecting a current state of a set of micro-objects located on a surface of a micro-assembler comprising a plurality of force generating pixels;
determining a next mode for a control component based on the current state of the set of micro-objects, wherein the control component is in a current mode;
identifying a set of control patterns based on the next mode; and
manipulate the set of micro-objects using the set of control patterns, wherein each control pattern of the set of control patterns indicates a voltage pattern on a portion of the plurality of force generating pixels;
wherein a second set of control patterns is used to manipulate the set of micro-objects when the control component is in the current mode.
2. The method of claim 1 , wherein the current mode of the control component comprises one or more of:
a rotating mode;
an unsticking mode;
an anchoring mode;
a translating mode;
a pulling down mode;
a transferring mode; and
an unassigned mode.
3. The method of claim 1 , wherein the next mode is determined further based on a desired state for the set of micro-objects.
4. The method of claim 1 , wherein the current state of the set of micro-objects is determined when the control component is in a translation mode.
5. The method of claim 1 , wherein the set of control patterns are one or more of:
automatically generated by a computing device;
based on user input; and
based on previous testing of the set of control patterns.
6. The method of claim 1 , wherein the set of control patterns indicates at least one refresh rate for a first control pattern of the set of control patterns.
7. The method of claim 1 , wherein different control patterns of the set of control patterns are used at different time periods.
8. The method of claim 1 , wherein manipulating the set of micro-objects comprises:
identifying a set of target areas;
associating the set of micro-objects with the set of target areas; and
moving the set of micro-objects to the set of target areas.
9. The method of claim 1 , wherein the set of control patterns cause one or more of electrophoretic forces or dielectrophoretic forces to be exerted on the set of micro-objects.