Micro assembler with fine angle control
First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.
1. An apparatus, comprising:
an assembly surface operable to receive objects, the assembly surface comprising an array of electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the objects;
a field generator operable to apply a rotation field to the objects on the assembly surface, the rotation field orthogonal to the clamping force field; and
a processor coupled to the field generator, the processor selectively activating the rotation field to selectively rotate the objects to different desired orientation angles.
2. The apparatus of claim 1 , wherein the objects have inherent properties that cause the objects to align to the rotation field.
3. The apparatus of claim 2 , wherein the rotation field comprises a magnetic field, and wherein the inherent properties comprise an anisotropic magnetic response.
4. The apparatus of claim 1 , wherein the rotation field comprises a magnetic field, and wherein the objects are mated to magnetic materials.
5. The apparatus of claim 1 , wherein the assembly surface is covered by a dielectric fluid that assists in smooth movements of the objects on the assembly surface.
6. The apparatus of claim 1 , wherein the processor outputs a modulated signal to cause the field generator to produce a time-varying field that induces small angular movements in the objects.
7. The apparatus of claim 1 , wherein the assembly surface comprises a first electrode that is selectively activated to apply a clamping force preventing a first one of the objects from rotating when the rotation field is activated.
8. The apparatus of claim 7 , wherein the assembly surface comprises a second electrode that is activated to partially clamp a second one of the objects so that a rotation point of the second object is fixed while the second object is rotated.
9. The apparatus of claim 1 , wherein the assembly surface comprises a plurality of electrodes that are activated to partially clamp the objects so that a rotation point of the objects are fixed while the objects are rotated.
10. The apparatus of claim 9 , wherein the electrodes are further activated to move the objects to specific locations on the assembly surface.
11. A method, comprising:
moving a plurality of objects onto an assembly surface, the assembly surface comprising an array of electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the objects;
apply a rotation field to the objects on the surface via a field generator the rotation field orthogonal to the clamping force field; and
selectively activating the rotation field to selectively rotate the objects to different desired orientation angles.
12. The method of claim 11 , wherein the objects have inherent properties that cause the objects to align to the rotation field.
13. The method of claim 12 , wherein the rotation field comprises a magnetic field, and wherein the inherent properties comprise an anisotropic magnetic response.
14. The method of claim 11 , wherein the rotation field comprises a magnetic field, and wherein the objects are mated to magnetic materials.
15. The method of claim 11 , wherein the assembly surface is covered by a dielectric fluid that assists in smooth movements of the objects on the assembly surface.
16. The method of claim 11 , wherein selectively activating the rotation field comprises t modulating a signal to cause the field generator to produce a time-varying field that induces small angular movements in the objects.
17. The method of claim 11 , further comprising selectively activating a first electrode to apply a clamping force that prevents a first one of the objects from rotating when the rotation field is activated.
18. The method of claim 17 , further comprising activating a second electrode to partially clamp a second one of the objects so that a rotation point of the second object is fixed while the second object is rotated.
19. The method of claim 11 , further comprising activating a plurality of electrodes to partially clamp the objects so that a rotation point of the objects are fixed while the objects are rotated.
20. The method of claim 19 , further comprising moving the objects to specific locations on the assembly surface via the electrodes.