Patent Application
Provisional
App. No. 60/594,608
· Confirmation No. 2571
MICRO CHIP SCALE PACKAGE SYSTEM
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-05-02 | CFILE |
Request for Corrected Filing Receipt | 4 | View | |
| 2005-04-22 | ADS |
Application Data Sheet | 3 | View | |
| 2005-04-22 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-04-22 | TRNA |
Transmittal of New Application | 2 | View | |
| 2005-04-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2005-04-22 | SPEC |
Specification | 5 | View | |
| 2005-04-22 | CLM |
Claims | 1 | View | |
| 2005-04-22 | ABST |
Abstract | 1 | View | |
| 2005-04-22 | DRW |
Drawings-only black and white line drawings | 2 | View |
Inventors
Jong Kook KIM
Suwon City, KOREA, REPUBLIC OF
Hun Teak LEE
Ichon City, KOREA, REPUBLIC OF
Jason LEE
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-148P
- Confirmation No.
- 2571
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/594,608
- Filed
- 2005-04-22
External Links