Patent Application
Provisional
App. No. 60/969,600
· Confirmation No. 5317
STAIR STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-09-12 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-08-31 | ADS |
Application Data Sheet | 5 | View | |
| 2007-08-31 | SPEC |
Specification | 9 | View | |
| 2007-08-31 | CLM |
Claims | 1 | View | |
| 2007-08-31 | ABST |
Abstract | 1 | View | |
| 2007-08-31 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2007-08-31 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-08-31 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
DaeSik Choi
Seoul, KOREA, REPUBLIC OF
BumJoon Hong
Seoul, KOREA, REPUBLIC OF
Sang-Ho Lee
Kyounggi, KOREA, REPUBLIC OF
Jong-Woo Ha
Seoul, KOREA, REPUBLIC OF
Soo-San Park
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-442P
- Confirmation No.
- 5317
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-09-09
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Quick Facts
- App. No.
- 60/969,600
- Filed
- 2007-08-31
External Links