IP Library › Granted Patent US 8,383,458
Granted Patent Utility
US 8,383,458 · Confirmation No. 3390

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN OFFSET STACKED CONFIGURATION AND METHOD FOR MANUFACTURING THEREOF

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Quick Facts
Patent No.
US 8,383,458
App. No.
12/974,265
Filed
2010-12-21
Granted
2013-02-26
Pub. No.
US20110084373A1
Art Unit
2815
PTA
0 days