Patent Assignment
Reel/Frame 003854/0294
Assignment of Assignors Interest.
Recorded: 1981-04-22
Pages: 3
Assignee
CONSOLIDATED REFINING CO., INC.
115 HOYT AVE., MAMARONECK, NEW YORK, 10543
Covered Property
(1)
Lid Assembly for Hermetic Sealing of a Semiconductor Chip
Patent:
4,331,253 →
Application:
06/243,389 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignors Interest.
Jan 10, 1983
From: CONSOLIDATED REFINING COMPANY, INC.
To: SEMICONDUCTOR PACKAGING MATERIALS CO., INC.; A CORP OF NY.
Reel/Frame 004084/0660 →
Amended Security Agreement
Dec 3, 1998
From: SEMX CORPORATION F/K/A SEMICONDUCTOR PACKAGING MATERIALS CO., INC.
To: FIRST UNION NATIONAL BANK F/K/A FIRST UNION NATIONAL BANK OF CONNECTICUT
Reel/Frame 009614/0169 →