IP Library › Assignment 009614/0169
Patent Assignment
Reel/Frame 009614/0169

Amended Security Agreement

Recorded: 1998-12-03 Pages: 5
Assignor
Assignee
FIRST UNION NATIONAL BANK F/K/A FIRST UNION NATIONAL BANK OF CONNECTICUT
300 MAIN STREET, STAMFORD, CONNECTICUT, 06904
Covered Properties (2)
Lid Assembly for Hermetic Sealing of a Semiconductor Chip
Patent: 4,331,253 →
Application: 06/243,389 →
Automatic Wire De-Spooler for Wire Bonding Machines
Patent: 5,318,234 →
Application: 07/934,258 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Apr 22, 1981
From: GORDON RICHARD; CIALLELLA JOHN G.
To: CONSOLIDATED REFINING CO., INC.
Reel/Frame 003854/0294 →
Assignment of Assignors Interest. Jan 10, 1983
From: CONSOLIDATED REFINING COMPANY, INC.
To: SEMICONDUCTOR PACKAGING MATERIALS CO., INC.; A CORP OF NY.
Reel/Frame 004084/0660 →
Assignment of Assignor's Interest Feb 28, 1994
From: BIGGS, KENNETH L.; GORDON, RICHARD
To: WEST BOND, INC.
Reel/Frame 006876/0545 →
Security Interest Dec 6, 1999
From: SEMX CORPORATION; POLESE COMPANY, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 010437/0905 →
Security Agreement Jan 28, 2009
From: SEMX CORPORATION
To: MFC CAPITAL FUNDING, INC., AS AGENT
Reel/Frame 022162/0428 →