Patent Assignment
Reel/Frame 022162/0428
Security Agreement
Recorded: 2009-01-28
Pages: 9
Assignor
SEMX CORPORATION
Executed: 2009-01-22
Assignee
MFC CAPITAL FUNDING, INC., AS AGENT
111 SOUTH WACKER DRIVE, SUITE 5050, CHICAGO, ILLINOIS, 60606
Covered Properties
(3)
Automatic Wire De-Spooler for Wire Bonding Machines
Patent:
5,318,234 →
Application:
07/934,258 →
Solder deposit method on electronic packages for post-connection process
Application:
11/323,444 →
Publication:
US 2007/0152023
Method for Depositing Solder Material on an Electronic Component Part Using Separators
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 28, 1994
From: BIGGS, KENNETH L.; GORDON, RICHARD
To: WEST BOND, INC.
Reel/Frame 006876/0545 →
Amended Security Agreement
Dec 3, 1998
From: SEMX CORPORATION F/K/A SEMICONDUCTOR PACKAGING MATERIALS CO., INC.
To: FIRST UNION NATIONAL BANK F/K/A FIRST UNION NATIONAL BANK OF CONNECTICUT
Reel/Frame 009614/0169 →
Security Interest
Dec 6, 1999
From: SEMX CORPORATION; POLESE COMPANY, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 010437/0905 →
Assignment of Assignor's Interest
Dec 30, 2005
From: MONTERULO, LARRY C.
To: SEMX CORPORATION
Reel/Frame 017438/0450 →
Assignment of Assignor's Interest
Dec 30, 2005
From: HUTH, KENNETH J.
To: SEMX CORPORATION
Reel/Frame 017436/0796 →
Assignment of Assignor's Interest
Dec 30, 2005
From: SUGRUE, JOHN C.
To: SEMX CORPORATION
Reel/Frame 017438/0448 →
Assignment of Assignor's Interest
Dec 23, 2008
From: MONTERULO, LAWRENCE C.; HUTH, KENNETH J.
To: SEMX CORPORATION
Reel/Frame 022022/0538 →
Merger
Sep 24, 2012
From: SEMX, INC.
To: COINING, INC.
Reel/Frame 029014/0479 →