Patent Assignment
Reel/Frame 017438/0448
Assignment of Assignor's Interest
Recorded: 2005-12-30
Pages: 2
Assignor
SUGRUE, JOHN C.
Executed: 2005-12-19
Assignee
SEMX CORPORATION
1 LABRIOLA COURT, ARMONK, NEW YORK, 10504
Covered Property
(1)
Solder deposit method on electronic packages for post-connection process
Application:
11/323,444 →
Publication:
US 2007/0152023
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2005
From: HUTH, KENNETH J.
To: SEMX CORPORATION
Reel/Frame 017436/0796 →
Assignment of Assignor's Interest
Dec 30, 2005
From: MONTERULO, LARRY C.
To: SEMX CORPORATION
Reel/Frame 017438/0450 →
Security Agreement
Jan 28, 2009
From: SEMX CORPORATION
To: MFC CAPITAL FUNDING, INC., AS AGENT
Reel/Frame 022162/0428 →