IP Library Assignment 029014/0479
Patent Assignment
Reel/Frame 029014/0479

Merger

Recorded: 2012-09-24 Pages: 5
Assignor
SEMX, INC.
Executed: 2012-08-08
Assignee
COINING, INC.
1100 CASSATT ROAD, BERWYN, PENNSYLVANIA, 19312
Covered Property (1)
Method for Depositing Solder Material on an Electronic Component Part Using Separators
Patent: 7,946,470 →
Application: 11/523,895 →
Publication: US 2007/0152017
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2008
From: MONTERULO, LAWRENCE C.; HUTH, KENNETH J.
To: SEMX CORPORATION
Reel/Frame 022022/0538 →
Security Agreement Jan 28, 2009
From: SEMX CORPORATION
To: MFC CAPITAL FUNDING, INC., AS AGENT
Reel/Frame 022162/0428 →