IP Library › Assignment 022022/0538
Patent Assignment
Reel/Frame 022022/0538

Assignment of Assignor's Interest

Recorded: 2008-12-23 Pages: 3
Assignors
MONTERULO, LAWRENCE C.
Executed: 2008-11-19
HUTH, KENNETH J.
Executed: 2008-12-03
Assignee
SEMX CORPORATION
1 LABRIOLA COURT, ARMONK, NEW YORK, 10504-1336
Covered Property (1)
Method for Depositing Solder Material on an Electronic Component Part Using Separators
Patent: 7,946,470 →
Application: 11/523,895 →
Publication: US 2007/0152017
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jan 28, 2009
From: SEMX CORPORATION
To: MFC CAPITAL FUNDING, INC., AS AGENT
Reel/Frame 022162/0428 →
Merger Sep 24, 2012
From: SEMX, INC.
To: COINING, INC.
Reel/Frame 029014/0479 →