Patent Assignment
Reel/Frame 005017/0790
Assignment of Assignors Interest.
Recorded: 1989-01-10
Pages: 1
Assignors
HUA, CHANG-HWANG
Executed: 1989-01-04
CHAN, SIMON SIU-SING
Executed: 1989-01-04
DAY, DING-YUAN S.
Executed: 1989-01-04
LEE, ADRIAN CHOK-CHING
Executed: 1989-01-04
Assignee
AVANTEK, INC., A CORP. OF CA.
3175 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054-3292
Covered Property
(1)
Method for the Simultaneous Formation of via-Holes and Wraparound Plating on Semiconductor Chips
Patent:
4,978,639 →
Application:
07/295,300 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 28, 1994
From: AVANTEK, INC.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 007185/0155 →
Merger
Apr 28, 2000
From: HEWLETT-PACKARD COMPANY, A CALIFORNIA CORPORATION
To: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
Reel/Frame 010841/0649 →
Assignment of Assignor's Interest
Jun 15, 2000
From: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
To: AGILENT TECHNOLOGIES INC.
Reel/Frame 010901/0336 →
Assignment of Assignor's Interest
Oct 10, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 018367/0245 →