Patent Assignment
Reel/Frame 018367/0245
Assignment of Assignor's Interest
Recorded: 2006-10-10
Pages: 46
Assignor
AGILENT TECHNOLOGIES, INC.
Executed: 2005-12-01
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Properties
(85)
Apparatus and Method for Modulating Light to Generate an Index Pulse
Patent:
4,451,731 →
Application:
06/291,666 →
Technique of Producing Tapered Features in Integrated Circuits
Patent:
4,514,252 →
Application:
06/442,545 →
Housing for Interfacing a Semiconductor Device with a Fiber Optic Cable
Patent:
4,479,696 →
Application:
06/478,217 →
Method for Making a Self-Aligned Vertically Stacked Gate Mos Device
Patent:
4,488,348 →
Application:
06/504,632 →
Cvd Lateral Epitaxial Growth of Silicon Over Insulators
Patent:
4,522,662 →
Application:
06/522,804 →
Interlocking Door Latch for Dockable Interface for Integrated Circuit Processing
Patent:
4,534,389 →
Application:
06/594,498 →
Use of an Electronic Vernier for Evaluation of Alignment in Semiconductor Processing
Patent:
4,566,193 →
Application:
06/636,480 →
Imaging Monochromator
Patent:
4,676,597 →
Application:
06/688,296 →
Method for Positioning a Crystal Ingot
Patent:
4,884,887 →
Application:
07/006,396 →
Method and Process for Testing the Reliability of Integrated Circuit (Ic) Chips and Novel Ic Circuitry for Accomplishing Same
Patent:
4,855,672 →
Application:
07/051,888 →
Bipolar Transistor Process Using Sidewall Spacer for Aligning Base Insert
Patent:
4,857,476 →
Application:
07/148,419 →
Transistor Amplifier for High Slew Rates and Capacitive Loads
Patent:
4,881,045 →
Application:
07/260,854 →
Switched-Capacitor Analog-to-Digital Converter with Autocalibration
Patent:
5,012,247 →
Application:
07/274,104 →
Method for Forming Tungsten Structures in a Semiconductor
Patent:
4,925,524 →
Application:
07/293,550 →
Method for the Simultaneous Formation of via-Holes and Wraparound Plating on Semiconductor Chips
Patent:
4,978,639 →
Application:
07/295,300 →
Method and Process for Testing the Reliability of Integrated Circuit (Ic) Chips and Novel Ic Circuitry for Accomplishing Same
Patent:
4,918,385 →
Application:
07/307,727 →
High Capacitance Cable
Patent:
4,926,008 →
Application:
07/353,949 →
Method of Fabricating a Coplanar, Self-Aligned Contact Structure in a Semiconductor Device
Patent:
4,994,402 →
Application:
07/400,609 →
Carbon Doping Mosfet Substrate to Suppress Hit Electron Trapping
Patent:
4,992,840 →
Application:
07/412,067 →
Yig Tuned Oscillator Using Composite Feedback
Patent:
4,988,959 →
Application:
07/429,826 →
Light Emitting Diode Array Current Power Supply
Patent:
5,099,192 →
Application:
07/597,259 →
Method for Patterning Aluminum Metallizations
Patent:
5,369,053 →
Application:
07/667,250 →
Rapid Wafer Thinning Process
Patent:
5,127,984 →
Application:
07/694,904 →
Local Tristate Control Circuit
Patent:
5,136,185 →
Application:
07/763,083 →
Method of Forming and Etching Titanium-Tungsten Interconnects
Patent:
5,164,331 →
Application:
07/770,595 →
Method for Reducing Selectivity Loss in Selective Tungsten Deposition
Patent:
5,200,360 →
Application:
07/792,520 →
Integrated Circuit Memory Device with a Redundant Memory Block
Patent:
5,255,217 →
Application:
07/818,667 →
Integrated Circuit for Physiological Signal Measurement
Patent:
5,382,956 →
Application:
07/876,645 →
Signal Processing Circuits with Digital Programmability
Patent:
5,337,230 →
Application:
07/876,841 →
Small Value Precision Integrated Circuit Resistors
Patent:
5,257,005 →
Application:
07/931,615 →
Cmos Peak Amplitude Detector
Patent:
5,302,863 →
Application:
08/011,028 →
Composite Transversely Plastic Interconnect for Microchip Carrier
Patent:
5,324,569 →
Application:
08/023,526 →
Aperture Size Control for Etched Vias and Metal Contacts
Patent:
5,342,808 →
Application:
08/028,643 →
Method and Apparatus for Improving the Performance of Light Emitting Diodes
Patent:
5,514,627 →
Application:
08/186,196 →
Laminated Upper Cladding Structure for a Light-Emitting Device
Patent:
5,400,354 →
Application:
08/193,681 →
Composite Transversely Plastic Interconnect for Microchip Carrier
Patent:
5,409,157 →
Application:
08/207,321 →
Selective Epitaxial Silicon for Intrinsic-Extrinsic Base Link
Patent:
5,420,454 →
Application:
08/269,992 →
Wavelength Selective Optical Switch
Patent:
5,448,660 →
Application:
08/271,016 →
Device for Extraction and Re-Insertion of an Optical Carrier in Optical Communications Networks
Patent:
5,479,082 →
Application:
08/271,115 →
Trench Isolation Using Doped Sidewalls
Patent:
5,401,998 →
Application:
08/296,611 →
Reworkable Die Attachment to Heat Spreader
Patent:
5,749,988 →
Application:
08/310,358 →
Method of and Device for the Fine Synchronization of Atm Cells in Optical Atm Nodes
Patent:
5,581,388 →
Application:
08/331,202 →
Semiconductor Devices Fabricated with Passivated High Aluminum-Content Iii-V Material
Patent:
5,517,039 →
Application:
08/339,034 →
Method for the Fabrication of Fluoride Glass Single Mode Optical Fibres with Flowing of an Etchant Through the Fiber Preform
Patent:
5,656,056 →
Application:
08/362,661 →
Method of Making Surface Emitting Laser Using Two Wafer Bonded Mirrors
Application:
08/495,150 →
Optical Amplifier
Patent:
5,673,141 →
Application:
08/528,757 →
Transmitter Module for Optical Interconnections
Patent:
5,596,664 →
Application:
08/531,244 →
Ring Network Communication Structure on an Optical Carrier and Reconfigurable Node for Said Structure
Patent:
5,647,035 →
Application:
08/531,851 →
Nonlinear Optical Element for Extremely High Bit Rates
Patent:
5,689,357 →
Application:
08/531,852 →
Packaging System for Semiconductor Components
Patent:
5,917,236 →
Application:
08/569,443 →
Optical Add-Drop Multiplexer for Optical Communication Networks
Patent:
5,812,291 →
Application:
08/603,862 →
Susceptor Leveling Aid
Patent:
5,826,345 →
Application:
08/643,425 →
Cost Effective Structure and Method for Interconnecting a Flip Chip with a Substrate
Patent:
5,764,486 →
Application:
08/728,876 →
Surface Emitting Laser Using Two Wafer Bonded Mirrors
Patent:
6,277,696 →
Application:
08/751,038 →
Method for Forming a Controlled Impedance Flex Circuit
Patent:
5,768,776 →
Application:
08/876,819 →
Method of and Device for Controlling the Phase of a Clock Signal in a Point-to-Point Optical Transmission
Patent:
5,917,633 →
Application:
08/954,953 →
Optical Viewer with an Aperture Transformer
Patent:
5,923,476 →
Application:
09/007,917 →
Method of and Device for Measuring Return Losses in Optical Fibre Components
Patent:
5,864,400 →
Application:
09/010,903 →
Integrated Circuit Having Memory Built-in Self Test (Bist) for Different Memory Sizes and Method of Operation
Patent:
6,151,692 →
Application:
09/059,620 →
Method of and a Device for Making Bragg Gratings in Optical Fibers or Waveguides
Patent:
5,953,472 →
Application:
09/067,515 →
Digital Camera Having Display Device for Displaying Graphical Representation of User Input and Method for Transporting the Selected Digital Images Thereof
Patent:
6,167,469 →
Application:
09/081,491 →
Authentication Stamping in a Digital Camera
Digital Image Processor for a Digital Camera
Patent:
6,642,956 →
Application:
09/087,253 →
Prorammable Control of Operational Signals in a Digital Camera
Patent:
6,593,963 →
Application:
09/087,266 →
High Speed Stackable Memory System and Device
Patent:
6,109,929 →
Application:
09/124,424 →
Fibre Bragg Grating with Offset Equivalent Mirror Plane and Method for Its Manufacture
Patent:
6,201,910 →
Application:
09/265,004 →
Laser Module with External Cavity and Optical Fibre Reflector
Patent:
6,226,311 →
Application:
09/265,007 →
Method for Optical Signal Transmission with Chromatic Dispersion Compensation Through Chirped Optical Fibre Gratings, and Optical Communication System Using the Method
Patent:
6,476,950 →
Application:
09/294,825 →
Image Interpolation Circuit Architecture and Method for Fast Bi-Cubic Interpolation of Image Information
Patent:
6,300,935 →
Application:
09/295,727 →
Method of Fast Bi-Cubic Interpolation of Image Information
Patent:
6,320,593 →
Application:
09/296,194 →
Cooling Apparatus for Electronic Devices
Patent:
6,157,539 →
Application:
09/373,664 →
Cooling Apparatus for Electronic Devices
Application:
09/376,627 →
Publication:
US 2001/0050164
Signal detection scheme for data communication links
Application:
09/734,794 →
Publication:
US 2002/0070766
Optical Transceiver Module with Ambient Light Circuitry
Method and Apparatus for Reducing Optical Insertion Loss in Planar Lightwave Circuits Through Dielectric Perturbation Optimization
Long-Wavelength Photonic Device with Gaassb Quantum-Well Layer
Digital camera
Application:
10/175,709 →
Publication:
US 2003/0048361
Cooling Apparatus for Dissipating Heat from a Heat Source
Power Amplification Apparatus of Portable Terminal
High Efficiency Power Amplifier with Multiple Power Modes
Digital Image Processor for a Digital Camera
Multiple Power Mode Amplifier with Bias Modulation Option and Without Bypass Switches
High Efficiency Power Amplifier
High Efficiency Power Amplifier with Multiple Power Modes
High Efficiency Power Amplifier with Multiple Power Modes
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Aug 20, 2001
From: HEWLETT-PACKARD COMPANY A CALIFORNIA CORPORATION
To: HEWLETT-PACKARD COMPANY A DELAWARE CORPORATION
Reel/Frame 012075/0892 →
Assignment of Assignor's Interest
Dec 31, 2001
From: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 012381/0616 →