Patent Assignment
Reel/Frame 006468/0103
Assignment of Assignors Interest.
Recorded: 1993-02-24
Pages: 3
Assignees
FUJITSU LIMITED
1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211, JAPAN
KYUSHU FUJITSU ELECTRONICS LIMITED
5950, SOEDA, IRIKI-CHO, SATSUMA-GUN, KAGOSHIMA 895-14, JAPAN
Covered Property
(1)
Process for Fabricating an Integrated Circuit Device by Forming a Planarized Polysilazane Layer and Oxidizing to Form Oxide Layer
Patent:
5,310,720 →
Application:
08/021,573 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignors Interest.
Feb 24, 1993
From: MAUCHER, PAUL
To: LUK LAMELLEN UND KUPPLUNGSBAU GMBH
Reel/Frame 006471/0997 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Aug 4, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024785/0608 →
Merger
Jul 23, 2013
From: KYUSHU FUJITSU ELECTRONICS LTD.
To: FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
Reel/Frame 030872/0593 →
Assignment of Assignor's Interest
Aug 13, 2013
From: FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
To: FUJITSU SEMICONDUCTOR LTD.
Reel/Frame 031001/0558 →