Patent Assignment
Reel/Frame 006606/0822
Assignment of Assignor's Interest
Recorded: 1993-05-27
Pages: 2
Assignor
TSURUTA, SHOJI
Executed: 1993-05-06
Assignees
MITSUBISHI MATERIALS CORPORATION
5-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
MITSUBISHI MATERIALS SILICON CORPORATION
8-16, IWAMOTO-CHO 3-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Continuous Heat Treatment System of Semiconductor Wafers for Eliminating Thermal Donor
Patent:
5,449,883 →
Application:
08/041,316 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 5, 2011
From: MITSUBISHI MATERIALS SILICON CORPORATION
To: SUMITOMO MITSUBISHI SILICON CORPORATION
Reel/Frame 026074/0552 →
Change of Name
Apr 7, 2011
From: SUMITOMO MITSUBISHI SILICON CORPORATION
To: SUMCO CORPORATION
Reel/Frame 026100/0718 →
Assignment of Assignor's Interest
Oct 5, 2011
From: MITSUBISHE MATERIALS CORPORATION
To: SUMCO CORPORATION
Reel/Frame 027021/0207 →