Patent Assignment
Reel/Frame 006869/0106
Assignment of Assignor's Interest
Recorded: 1994-02-16
Pages: 9
Assignor
GOULD INC.
Executed: 1994-01-31
Assignee
GOULD ELECTRONICS INC.
35129 CURTIS BLVD., EASTLAKE, OHIO, 44095
Covered Properties
(39)
Electrodeposited Copper Foil and Process for Making Same Using Electrolyte Solutions Having Low Chloride Ion Concentrations
Application:
07/531,452 →
Apparatus for Electrodepositing Metal
Patent:
5,393,396 →
Application:
07/605,648 →
Resistive Metal Layers and Method for Making Same
Application:
07/615,927 →
Fuse with Thin Film Fusible Element Supported on a Substrate
Patent:
5,115,220 →
Application:
07/637,161 →
Thin Film Fusible Element
Patent:
5,091,712 →
Application:
07/673,190 →
Thin Film Fuse Construction
Patent:
5,095,297 →
Application:
07/700,537 →
Metal Foil with Improved Peel Strength and Method for Making Said Foil
Application:
07/722,976 →
Electrodeposited Copper Foil and Process for Making Same Using Electrolyte Solutions Having Low Chloride Ion Concentrations
Patent:
5,421,985 →
Application:
07/865,791 →
Method of Making Flexible PR4INTED Circuit Sensor Assembly for Detecting Optical Pulses
Patent:
5,263,244 →
Application:
07/870,247 →
Method and Apparatus for Sequentially Metalizing Polymeric Films and Products Made Thereby
Application:
07/907,066 →
Broadband Mxn Optical Fiber Couplers and Method of Making
Patent:
5,355,426 →
Application:
07/939,011 →
Universal Carrier Supported Thin Copper Line
Patent:
5,322,975 →
Application:
07/947,711 →
Panel Mount Fuse Assembly
Patent:
5,267,879 →
Application:
07/970,774 →
Solder Sealed Solid Electrolyte Cell Housed Within a Ceramic Frame and the Method for Producing It
Patent:
5,279,624 →
Application:
07/982,556 →
Laser Sealed Solid Electrolyte Cell Housed Within a Ceramic Frame and the Method for Producing It
Patent:
5,336,273 →
Application:
07/982,621 →
Adhesive Sealed Solid Electrolyte Cell Housed Within a Ceramic Frame and the Method for Producing It
Patent:
5,314,507 →
Application:
07/982,622 →
Method for Inhibiting the Electrodeposition of Organic Particulate Matter on Copper Foil
Patent:
5,840,170 →
Application:
07/982,999 →
Compact Rail Mountable Fuse Holder
Patent:
5,318,462 →
Application:
07/990,790 →
Thin Plate Anode
Patent:
5,344,538 →
Application:
08/002,596 →
Peptides Useful for Tolerization
Application:
08/006,116 →
Externally Mounted Blown Fuse Indicator
Patent:
5,319,344 →
Application:
08/007,076 →
Anti-Oxidant Coatings for Copper Foils
Patent:
5,332,486 →
Application:
08/011,367 →
Metal Foil with Improved Peel Strength and Method for Making Said Foil
Application:
08/022,797 →
Process for Making Copper Metal Powder, Copper Oxides and Copper Foil
Application:
08/049,160 →
Process for Making Copper Foil
Patent:
5,366,612 →
Application:
08/049,176 →
Current Limiting Fuse
Patent:
5,357,234 →
Application:
08/052,355 →
Current Limiting Fuse
Patent:
5,296,832 →
Application:
08/052,388 →
Current Limiting Fuse
Patent:
5,294,905 →
Application:
08/052,580 →
Foil with Adhesion Promoting Layer Derived from Silane Mixture
Application:
08/053,721 →
Drum Cathode for Use in the Production of Metal Foils and a Method of Producing the Same
Patent:
5,372,297 →
Application:
08/056,186 →
Styrene Type Monomers Containing Substituents Thereon, E.G. Urea, and Polymers and Copolymers Thereof
Patent:
5,401,825 →
Application:
08/056,931 →
Method of Etching Polyimide
Patent:
5,350,487 →
Application:
08/057,005 →
Electrodeposited Copper Foil and Process for Making Same Using Electrolyte Solutions Having Controlled Additions of Chloride Ions and Organic Additives
Patent:
5,403,465 →
Application:
08/068,690 →
Time Delay Fuse with Mechanical Overload Device
Patent:
5,343,185 →
Application:
08/094,609 →
Method and Apparatus for Sequentially Metalizing Polymeric Films and Products Made Thereby
Application:
08/098,440 →
Solder Sealed Solid Electrolyte Cell Housed Within a Ceramic Frame and the Method for Producing It
Patent:
5,362,579 →
Application:
08/139,422 →
Flexible Printed Circuit Sensor Assembly for Detecting Optical Pulses
Patent:
5,390,670 →
Application:
08/139,564 →
Electrodeposited Copper Foil and Process for Making Same
Patent:
5,431,803 →
Application:
08/141,483 →
Time Delay Fuse
Patent:
5,361,058 →
Application:
08/146,319 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
May 30, 1990
From: HASEGAWA, C.J.; CLOUSER, S. J.; DIFRANCO, D. F.
To: GOULD, INC.
Reel/Frame 005342/0938 →
Assignment of Assignors Interest.
Oct 30, 1990
From: DEWITT, ROBERT D.; BAY, ADAM G.; PARADAY, TIBOR
To: GOULD INC.
Reel/Frame 005501/0225 →
Assignment of Assignors Interest.
Jan 3, 1991
From: SUURONEN, DAVID E.; TERRY, JEAN C.
To: GOULD INC., A CORP OF DE
Reel/Frame 005575/0102 →
Assignment of Assignors Interest.
Mar 21, 1991
From: SUURONEN, DAVID E.
To: GOULD INC.
Reel/Frame 005653/0402 →
Assignment of Assignors Interest.
May 14, 1991
From: PERREAULT, RICHARD J.; TERRY, JEAN C.; FITZGERALD, LEEMAN G.
To: GOULD, INC., A CORPORATION OF DE
Reel/Frame 005706/0813 →
Assignment of Assignors Interest.
Jun 28, 1991
From: SADEY, RICHARD J.; ZATT, DENNIS M.
To: GOULD, INC. A CORP. OF OH
Reel/Frame 005767/0041 →
Assignment of Assignors Interest.
Apr 17, 1992
From: CENTA, JOHN A.; HALASZ, LASZLO
To: GOULD INC.
Reel/Frame 006097/0585 →
Assignment of Assignors Interest.
Aug 28, 1992
From: AMEEN, THOMAS J.; DEWITT, ROBERT D.; PECKHAM, PETER
To: GOULD INC.
Reel/Frame 006257/0458 →
Assignment of Assignors Interest.
Sep 18, 1992
From: NAGY, ALBERT E.; AMEEN, THOMAS J.; PECKHAM, PETER
To: GOULD INC.
Reel/Frame 006326/0781 →
Assignment of Assignors Interest.
Nov 3, 1992
From: OAKLEY, GEORGE H.
To: GOULD, INC.
Reel/Frame 006341/0662 →
Assignment of Assignors Interest.
Nov 27, 1992
From: ROSSOLL, MARY P.; REVILOCK, ALAN J.
To: GOULD INC.
Reel/Frame 006343/0609 →
Assignment of Assignors Interest.
Nov 27, 1992
From: ROSSOLL, MARY P.; REVILOCK, ALAN J.; WONG, ANTHONY S.
To: GOULD INC.
Reel/Frame 006349/0055 →
Assignment of Assignors Interest.
Nov 27, 1992
From: ROSSOLL, MARY P.
To: GOULD INC.
Reel/Frame 006343/0603 →
Assignment of Assignors Interest.
Dec 10, 1992
From: OAKLEY, GEORGE H.
To: GOULD, INC.
Reel/Frame 006360/0430 →
Assignment of Assignors Interest.
Jan 11, 1993
From: CHAMBERLAIN, JAMIE H.; BAY, ADAM G.; DEWITT, ROBERT D.
To: GOULD INC.
Reel/Frame 006381/0376 →
Assignment of Assignors Interest.
Feb 2, 1993
From: NAGY, ALBERT E.
To: GOULD INC.
Reel/Frame 006517/0787 →
Assignment of Assignor's Interest
Mar 19, 1993
From: MOSESIAN, JERRY L.; PARKER, HOWARD J.; PERREAULT, RICHARD J.; WALKER, GEORGE F.
To: GOULD INC.
Reel/Frame 006550/0613 →
Assignment of Assignor's Interest
Mar 29, 1993
From: GEFTER, MALCOLM L.; GARMAN, RICHARD D.; GREENSTEIN, JULIA L.; KUO, MEI-CHANG
To: IMMULOGIC PHARMACEUTICAL CORPORATION
Reel/Frame 006522/0233 →
Assignment of Assignor's Interest
Mar 30, 1993
From: DIFRANCO, DINO F.
To: GOULD INC.
Reel/Frame 006526/0733 →
Assignment of Assignor's Interest
Apr 27, 1993
From: POUTASSE, CHARLES A., III; KOVACS, ANDREA M.
To: GOULD INC.
Reel/Frame 006538/0504 →
Assignment of Assignor's Interest
May 24, 1993
From: DANIEL, HANI S.; MOORE, DOUGLAS R.; TEKIPPE, VINCENT J.
To: GOULD INC.
Reel/Frame 006544/0805 →
Assignment of Assignor's Interest
Jun 23, 1993
From: PERREAULT, RICHARD J.; PIMPIS, ROBERT M.
To: GOULD INC.
Reel/Frame 006589/0604 →
Assignment of Assignor's Interest
Jun 23, 1993
From: PIMPIS, ROBERT M.; PERREAULT, RICHARD J.; WALKER, GEORGE F., JR.; SUURONEN, DAVID E.
To: GOULD INC.
Reel/Frame 006593/0160 →
Assignment of Assignor's Interest
Jun 23, 1993
From: PIMPIS, ROBERT M.; GOLDSTEIN, MICHAEL A.; WALKER, GEORGE F., JR.
To: GOULD INC.
Reel/Frame 006589/0600 →
Assignment of Assignor's Interest
Sep 17, 1993
From: MOSESIAN, JERRY L.; PARKER, HOWARD J.; PERREAULT, RICHARD J.; WALKER, GEORGE F., JR.
To: GOULD INC.
Reel/Frame 006698/0199 →