Patent Assignment
Reel/Frame 007044/0744
Assignment of Assignor's Interest
Recorded: 1994-06-16
Pages: 6
Assignors
DEGANI, YINON
Executed: 1994-06-08
DUDDERAR, THOMAS DIXON
Executed: 1994-06-10
HAN, BYUNG JOON
Executed: 1994-06-09
RAJU, VENKATARAM REDDY
Executed: 1994-06-08
Assignee
AT&T CORP.
32 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10013-2412
Covered Property
(1)
Electronic Device Package Having Electronic Device Bonded, at a Localized Region Thereof, to Circuit Board
Patent:
5,473,512 →
Application:
08/260,859 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 1995
From: AT&T CORP.
To: AT&T IPM CORP.
Reel/Frame 007688/0517 →
Security Agreement
Oct 3, 2002
From: SYCHIP, INC.
To: SILICON VALLEY BANK
Reel/Frame 013305/0798 →
Release of Security Interest
May 16, 2005
From: SILICON VALLEY BANK
To: SYCHIP, INC.
Reel/Frame 016547/0870 →
Assignment of Assignor's Interest
Apr 25, 2006
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 017811/0368 →
Assignment of Assignor's Interest
Apr 25, 2006
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0383 →