Patent Assignment
Reel/Frame 017811/0368
Assignment of Assignor's Interest
Recorded: 2006-04-25
Pages: 15
Assignor
AT&T CORP.
Executed: 1996-03-29
Assignee
LUCENT TECHNOLOGIES INC.
600 MOUNTAIN AVENUE, MURRAY HILL, NEW JERSEY, 07974
Covered Properties
(14)
Integrated Circuit Package and Compact Assemblies Thereof
Patent:
5,043,794 →
Application:
07/587,308 →
Solder Paste
Patent:
5,150,832 →
Application:
07/724,561 →
Pseudo-Electroless, Followed by Electroless, Metallization of Nickel on Metallic Wires, as for Semiconductor Chip-to-Chip Interconnections
Patent:
5,264,107 →
Application:
07/809,694 →
Debondable Metallic Bonding Method
Patent:
5,234,149 →
Application:
07/938,194 →
Permanent Metallic Bonding Method
Patent:
5,234,153 →
Application:
07/938,195 →
Solder Paste and Method of Using the Same
Patent:
5,211,764 →
Application:
07/973,908 →
Method of Making an Article Comprising Solder Bump Bonding
Patent:
5,307,983 →
Application:
08/054,505 →
Surface Mount Solder Assembly of Leadless Integrated Circuit Packages to Substrates
Patent:
5,346,118 →
Application:
08/128,492 →
Multi-Chip Modules Having Chip-to-Chip Interconnections with Reduced Signal Voltage Level and Swing
Patent:
5,461,333 →
Application:
08/200,986 →
Process for Fabricating an Integrated Circuit
Patent:
5,516,728 →
Application:
08/220,771 →
Electronic Device Package Having Electronic Device Bonded, at a Localized Region Thereof, to Circuit Board
Patent:
5,473,512 →
Application:
08/260,859 →
Method for Bumping Silicon Devices
Patent:
5,505,367 →
Application:
08/333,168 →
Temporary Connections for Fast Electrical Access to Electronic Devices
Patent:
5,481,205 →
Application:
08/344,393 →
Method for Making Multichip Circuits Using Active Semiconductor Substrates
Patent:
5,534,465 →
Application:
08/370,902 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
May 16, 2005
From: SILICON VALLEY BANK
To: SYCHIP, INC.
Reel/Frame 016547/0870 →
Assignment of Assignor's Interest
Apr 25, 2006
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0383 →
Assignment of Assignor's Interest
Apr 25, 2006
From: LUCENT TECHNOLGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0404 →
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest
Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Assignment of Assignor's Interest
Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Assignment of Assignor's Interest
Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
Security Interest
Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Security Interest
Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
Release of Security Interest
Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →