IP Library › Assignment 016547/0870
Patent Assignment
Reel/Frame 016547/0870

Release of Security Interest

Recorded: 2005-05-16 Pages: 2
Assignor
SILICON VALLEY BANK
Executed: 2005-04-15
Assignee
SYCHIP, INC.
2805 NORTH DALLAS PKWY STE 400, PLANO, TEXAS, 75093
Covered Properties (50)
Integrated Circuit Chip and Substrate Assembly
Patent: 4,670,770 →
Application: 06/582,079 →
Interconnection Lines for Wafer-Scale-Integrated Assemblies
Patent: 4,703,288 →
Application: 06/719,533 →
Decentralized Bus Arbitration Using Distributed Arbiters Having Circuitry for Latching Lockout Signals Gate from Higher Priority Arbiters
Patent: 4,745,548 →
Application: 07/009,634 →
Optical Fiber Switch
Patent: 4,896,937 →
Application: 07/227,220 →
Optical Assembly Comprising Optical Fiber Coupling Means
Patent: 4,995,695 →
Application: 07/394,911 →
Optical Fiber Switch
Patent: 5,000,532 →
Application: 07/431,941 →
Integrated Circuit Package and Compact Assemblies Thereof
Patent: 5,043,794 →
Application: 07/587,308 →
Solder Paste
Patent: 5,150,832 →
Application: 07/724,561 →
Method of Soldering Including Removal of Flux Residue
Patent: 5,125,560 →
Application: 07/787,290 →
Bonding Method Using Solder Composed of Multiple Alternating Gold and Tin Layers
Patent: 5,197,654 →
Application: 07/792,559 →
Pseudo-Electroless, Followed by Electroless, Metallization of Nickel on Metallic Wires, as for Semiconductor Chip-to-Chip Interconnections
Patent: 5,264,107 →
Application: 07/809,694 →
Debondable Metallic Bonding Method
Patent: 5,234,149 →
Application: 07/938,194 →
Permanent Metallic Bonding Method
Patent: 5,234,153 →
Application: 07/938,195 →
Method for Assembling Multichip Modules
Patent: 6,077,725 →
Application: 07/940,157 →
Solder Paste and Method of Using the Same
Patent: 5,211,764 →
Application: 07/973,908 →
Method of Making an Article Comprising Solder Bump Bonding
Patent: 5,307,983 →
Application: 08/054,505 →
Surface Mount Solder Assembly of Leadless Integrated Circuit Packages to Substrates
Patent: 5,346,118 →
Application: 08/128,492 →
Soldering Material and Procedure
Patent: 5,385,290 →
Application: 08/158,131 →
Multi-Chip Modules Having Chip-to-Chip Interconnections with Reduced Signal Voltage Level and Swing
Patent: 5,461,333 →
Application: 08/200,986 →
Solder Paste Mixture
Patent: 5,382,300 →
Application: 08/216,225 →
Process for Fabricating an Integrated Circuit
Patent: 5,516,728 →
Application: 08/220,771 →
Electronic Device Package Having Electronic Device Bonded, at a Localized Region Thereof, to Circuit Board
Patent: 5,473,512 →
Application: 08/260,859 →
Method for Bumping Silicon Devices
Patent: 5,505,367 →
Application: 08/333,168 →
Temporary Connections for Fast Electrical Access to Electronic Devices
Patent: 5,481,205 →
Application: 08/344,393 →
Method for Making Multichip Circuits Using Active Semiconductor Substrates
Patent: 5,534,465 →
Application: 08/370,902 →
Packaging Multi-Chip Modules Without Wire-Bond Interconnection
Patent: 5,608,262 →
Application: 08/393,628 →
Bonding Scheme Using Group Vb Metallic Layer
Patent: 5,622,305 →
Application: 08/438,296 →
Self-Contained Memory Apparatus Having Diverse Types of Memory and Distributed Control
Patent: 6,029,224 →
Application: 08/477,175 →
Method and Apparatus for Assembling Multichip Modules
Patent: 5,564,617 →
Application: 08/479,587 →
Curbside Circuitry for Interactive Communication Services
Patent: 5,699,105 →
Application: 08/534,909 →
Electronic Device Package Enclosed by Pliant Medium Laterally Confined by a Plastic Rim Member
Patent: 5,767,447 →
Application: 08/567,659 →
Method and Apparatus for Forming Fine Patterns on Printed Circuit Board
Patent: 5,834,160 →
Application: 08/586,347 →
Thin Packaging of Multi-Chip Modules with Enhanced Thermal Power Management
Patent: 5,646,828 →
Application: 08/697,121 →
Multi-Chip Modules with Isolated Coupling Between Modules
Patent: 5,747,982 →
Application: 08/761,047 →
Cleaning Solder-Bonded Flip-Chip Assemblies
Patent: 5,778,913 →
Application: 08/803,474 →
Flip Chip Metallization
Patent: 5,904,859 →
Application: 08/825,923 →
Flip Chip Packaging of Memory Chips
Patent: 5,990,564 →
Application: 08/866,264 →
Rf Ic Package
Patent: 5,869,894 →
Application: 08/896,917 →
Method of Packaging Fragile Devices with a Gel Medium Confined by a Rim Member
Patent: 6,020,219 →
Application: 08/939,053 →
Chip-On-Chip Ic Packages
Patent: 5,898,223 →
Application: 08/946,980 →
Method for Testing Integrated Circuits
Patent: 6,043,670 →
Application: 08/991,867 →
Mcm with High Q Overlapping Resonator
Patent: 6,075,427 →
Application: 09/012,304 →
Manufacture of Flip-Chip Device
Patent: 6,015,652 →
Application: 09/032,338 →
Solder Bonding Printed Circuit Boards
Patent: 6,013,877 →
Application: 09/041,157 →
Solder Bonding Printed Circuit Boards
Patent: 6,100,475 →
Application: 09/067,271 →
High Speed Flip-Chip Dispensing
Patent: 5,966,903 →
Application: 09/085,643 →
Recessed Flip-Chip Package
Patent: 6,154,370 →
Application: 09/120,148 →
High Speed Flip-Chip Dispensing
Patent: 6,205,745 →
Application: 09/134,843 →
Translator for Recessed Flip-Chip Package
Patent: 6,160,715 →
Application: 09/149,804 →
Integrated Circuit Bonding Method and Apparatus
Patent: 6,074,897 →
Application: 09/238,706 →
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 19, 2006
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 017811/0345 →
Assignment of Assignor's Interest Apr 25, 2006
From: LUCENT TECHNOLGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0404 →
Assignment of Assignor's Interest Apr 25, 2006
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0352 →
Assignment of Assignor's Interest Apr 25, 2006
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 017811/0368 →
Assignment of Assignor's Interest Apr 25, 2006
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0383 →
Patent Security Agreement May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031) Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
Security Interest Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →