Patent Assignment
Reel/Frame 017811/0404
Assignment of Assignor's Interest
Recorded: 2006-04-25
Pages: 16
Assignor
LUCENT TECHNOLGIES INC.
Executed: 2001-01-30
Assignee
AGERE SYSTEMS INC.
1110 AMERICAN PARKWAY NE, ALLENTOWN, PENNSYLVANIA, 18109
Covered Properties
(20)
Method for Assembling Multichip Modules
Patent:
6,077,725 →
Application:
07/940,157 →
Method of Making an Article Comprising Solder Bump Bonding
Patent:
5,307,983 →
Application:
08/054,505 →
Packaging Multi-Chip Modules Without Wire-Bond Interconnection
Patent:
5,608,262 →
Application:
08/393,628 →
Bonding Scheme Using Group Vb Metallic Layer
Patent:
5,622,305 →
Application:
08/438,296 →
Self-Contained Memory Apparatus Having Diverse Types of Memory and Distributed Control
Patent:
6,029,224 →
Application:
08/477,175 →
Method and Apparatus for Assembling Multichip Modules
Patent:
5,564,617 →
Application:
08/479,587 →
Thin Packaging of Multi-Chip Modules with Enhanced Thermal Power Management
Patent:
5,646,828 →
Application:
08/697,121 →
Multi-Chip Modules with Isolated Coupling Between Modules
Patent:
5,747,982 →
Application:
08/761,047 →
Cleaning Solder-Bonded Flip-Chip Assemblies
Patent:
5,778,913 →
Application:
08/803,474 →
Flip Chip Metallization
Patent:
5,904,859 →
Application:
08/825,923 →
Flip Chip Packaging of Memory Chips
Patent:
5,990,564 →
Application:
08/866,264 →
Rf Ic Package
Patent:
5,869,894 →
Application:
08/896,917 →
Chip-On-Chip Ic Packages
Patent:
5,898,223 →
Application:
08/946,980 →
Method for Testing Integrated Circuits
Patent:
6,043,670 →
Application:
08/991,867 →
Mcm with High Q Overlapping Resonator
Patent:
6,075,427 →
Application:
09/012,304 →
Manufacture of Flip-Chip Device
Patent:
6,015,652 →
Application:
09/032,338 →
Recessed Flip-Chip Package
Patent:
6,154,370 →
Application:
09/120,148 →
High Speed Flip-Chip Dispensing
Patent:
6,205,745 →
Application:
09/134,843 →
Translator for Recessed Flip-Chip Package
Patent:
6,160,715 →
Application:
09/149,804 →
Integrated Circuit Bonding Method and Apparatus
Patent:
6,074,897 →
Application:
09/238,706 →
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 3, 1996
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 008196/0181 →
Assignment of Assignor's Interest
Oct 31, 1996
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 008179/0675 →
Assignment of Assignor's Interest
Nov 15, 2004
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 015980/0344 →
Release of Security Interest
May 16, 2005
From: SILICON VALLEY BANK
To: SYCHIP, INC.
Reel/Frame 016547/0870 →
Assignment of Assignor's Interest
Apr 25, 2006
From: AT&T CORP.
To: LUCENT TECHNOLOGIES INC.
Reel/Frame 017811/0368 →
Assignment of Assignor's Interest
Apr 25, 2006
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS INC.
Reel/Frame 017811/0383 →
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Merger
Feb 20, 2015
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 035058/0895 →
Assignment of Assignor's Interest
Feb 20, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035059/0001 →
Assignment of Assignor's Interest
Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement
Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Assignment of Assignor's Interest
Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Security Interest
Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Assignment of Assignor's Interest
Sep 24, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047022/0620 →
Corrective Assignment to Correct the Nature of Conveyance and Effective Date Previously Recorded on Reel 047022 Frame 0620. Assignor(S) Hereby Confirms the Merger.
Oct 2, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047185/0643 →
Corrective Assignment to Correct the Effective Date Previously Recorded on Reel 047185 Frame 0643. Assignor(S) Hereby Confirms the Merger.
Oct 26, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047476/0845 →
Corrective Assignment to Correct the Effective Date of Merger Previously Recorded at Reel: 047185 Frame: 0643. Assignor(S) Hereby Confirms the Corrective Merger.
Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047959/0296 →
Release of Security Interest
Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →