IP Library › Assignment 007274/0744
Patent Assignment
Reel/Frame 007274/0744

Assignment of Assignor's Interest

Recorded: 1994-12-08 Pages: 3
Assignors
YAMADA, YOSHIAKI
Executed: 1994-11-04
ITO, NOBUKAZU
Executed: 1994-11-04
MIYAKAWA, KUNIKO
Executed: 1994-11-04
YAMANAKA, MICHIKO
Executed: 1994-11-04
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Process for Manufacturing Semiconductor Device by Filling a via Hole in an Interlayered Film of the Device with Wiring Metal
Patent: 5,543,357 →
Application: 08/351,679 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 25, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013798/0626 →
Change of Name Oct 21, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025172/0931 →