IP Library › Assignment 007284/0242
Patent Assignment
Reel/Frame 007284/0242

Assignment of Assignor's Interest

Recorded: 1994-12-19 Pages: 5
Assignors
KORNFELD, BRUCE E.
Executed: 1994-12-02
ALEXANDER, ARTHUR R.
Executed: 1994-12-09
Assignee
AT&T GLOBAL INFORMATION SOLUTIONS COMPANY
LAW DEPARTMENT, 1700 S. PATTERSON BLVD., DAYTON, OHIO, 45479
Covered Property (1)
Three Dimensional Die Packaging in Multi-Chip Modules
Patent: 5,495,394 →
Application: 08/361,062 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 9, 1996
From: AT&T GLOBAL INFORMATION SOLUTIONS COMPANY
To: NCR CORPORATION
Reel/Frame 008047/0429 →
Assignment of Assignor's Interest Dec 10, 2004
From: NCR CORPORATION
To: STEINMETZ ELECTRICAL LLC
Reel/Frame 015428/0845 →
Merger Dec 7, 2010
From: STEINMETZ ELECTRICAL LLC
To: INTELLECTUAL VENTURES I LLC
Reel/Frame 025467/0109 →