Patent Assignment
Reel/Frame 007600/0290
Assignment of Assignor's Interest
Recorded: 1995-07-28
Pages: 5
Assignors
HUANG, KUEI-WU
Executed: 1995-07-21
CHAN, TSIU C.
Executed: 1995-07-21
LING, JAMIN
Executed: 1995-07-24
Assignee
SGS-THOMSON MICROELECTRONICS, INC.
1310 ELECTRONICS DR., M/S 2348, CARROLLTON, TEXAS, 75006
Covered Property
(1)
Method of Forming Planarized Multilevel Metallization in an Integrated Circuit
Patent:
6,191,484 →
Application:
08/508,973 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.