Patent Assignment
Reel/Frame 007679/0386
Assignment of Assignor's Interest
Recorded: 1995-08-18
Pages: 3
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Process for Forming Metal Interconnect Structures for Use with Integrated Circuit Devices to Form Integrated Circuit Structures
Patent:
5,756,395 →
Application:
08/516,614 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Assignment of Assignor's Interest
Sep 8, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024953/0596 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →