Patent Assignment
Reel/Frame 024953/0596
Assignment of Assignor's Interest
Recorded: 2010-09-08
Pages: 3
Assignor
LSI CORPORATION
Executed: 2010-08-18
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(8)
Process for Forming Metal Interconnect Structures for Use with Integrated Circuit Devices to Form Integrated Circuit Structures
Patent:
5,756,395 →
Application:
08/516,614 →
Multi-Layer Tab Tape Having Distinct Signal, Power and Ground Planes, Semiconductor Device Assembly Employing Same, Apparatus for and Method of Assembling Same
Patent:
5,854,085 →
Application:
08/638,898 →
Semiconductor Die with Staggered Bond Pads
Patent:
5,814,892 →
Application:
08/660,490 →
Progressive Staggered Bonding Pads
Patent:
5,796,171 →
Application:
08/712,981 →
Molded Tape Ball Grid Array Package
Patent:
6,489,571 →
Application:
09/703,199 →
Integrated Circuit Package Substrate with Multiple Voltage Supplies
Patent:
6,777,802 →
Application:
10/164,494 →
Stiffener Design
Heat Spreader in Integrated Circuit Package
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 18, 1995
From: ROSTOKER, MICHAEL D.; KAPOOR, ASHOK K.
To: LSI LOGIC CORPORATION
Reel/Frame 007679/0386 →
Assignment of Assignor's Interest
Jun 7, 1996
From: STEIDL, MICHAEL J.; DANDIA, SANJAY
To: LSI LOGIC CORPORATION
Reel/Frame 008117/0465 →
Assignment of Assignor's Interest
Sep 16, 1996
From: KOC, AYDIN; STEIDL, MICHAEL J.; DANDIA, SANJAY
To: LSI LOGIC CORPORATION
Reel/Frame 008232/0783 →
Assignment of Assignor's Interest
Mar 31, 1997
From: RAAB, KURT R.; MCCORMICK, JOHN
To: LSI LOGIC CORPORATION
Reel/Frame 008427/0858 →
Assignment of Assignor's Interest
Oct 31, 2000
From: CHIA, CHOK J.; LOW, QWAI H.; VARIOT, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 011274/0405 →
Assignment of Assignor's Interest
Jun 6, 2002
From: MORA, LEONARD L.; AWUJOOLA, ABI; FULCHER, ED
To: LSI LOGIC CORPORATION
Reel/Frame 013063/0273 →
Assignment of Assignor's Interest
Dec 3, 2002
From: RANADE, YOGENDRA; GOVIND, ANAND; NAGARAJAN, KUMAR; GHAHGHAHI, FARSHAD
To: LSI LOGIC CORPORATION
Reel/Frame 013547/0187 →
Assignment of Assignor's Interest
Jun 22, 2004
From: LIM, HONG T.; OTHIENO, MAURICE O.; LOW, QWAI H.
To: LSI LOGIC CORPORATION
Reel/Frame 015512/0723 →
Merger
Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
Change of Name
Jun 30, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 022878/0982 →
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Change of Name
Jul 27, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024741/0411 →
Change of Name
Aug 4, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024785/0742 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →