IP Library › Assignment 008117/0465
Patent Assignment
Reel/Frame 008117/0465

Assignment of Assignor's Interest

Recorded: 1996-06-07 Pages: 2
Assignors
STEIDL, MICHAEL J.
Executed: 1996-06-06
DANDIA, SANJAY
Executed: 1996-06-06
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Semiconductor Die with Staggered Bond Pads
Patent: 5,814,892 →
Application: 08/660,490 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 4, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024785/0742 →
Assignment of Assignor's Interest Sep 8, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024953/0596 →
Change of Name Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →