Patent Assignment
Reel/Frame 011274/0405
Assignment of Assignor's Interest
Recorded: 2000-10-31
Pages: 2
Assignors
CHIA, CHOK J.
Executed: 2000-10-26
LOW, QWAI H.
Executed: 2000-10-26
VARIOT, PATRICK
Executed: 2000-10-26
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MS D106, MILPITAS, CALIFORNIA, 95053
Covered Property
(1)
Molded Tape Ball Grid Array Package
Patent:
6,489,571 →
Application:
09/703,199 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 30, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 022878/0982 →
Change of Name
Jul 27, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024741/0411 →
Assignment of Assignor's Interest
Sep 8, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024953/0596 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →