Patent Assignment
Reel/Frame 022878/0982
Change of Name
Recorded: 2009-06-30
Received: 2009-06-30
Pages: 7
Assignor
LSI LOGIC CORPORATION
Executed: 2007-04-06
Assignee
LSI CORPORATION
1621 BARBER LANE, MS: D-106, MILPITAS, CA, 95035, UNITED STATES
Covered Properties
(6)
Integrated Circuit Package and Method for a Pbga Package Having a Multiplicity of Staggered Power Ring Segments for Power Connection to Integrated Circuit Die
Application:
10/626,366 →
Designing a Ball Assignment for a Ball Grid Array Package
Application:
10/452,874 →
Integrated Circuit Packaging That Uses Guard Conductors to Isolate Noise-Sensitive Signals Within the Package Substrate
Application:
10/435,805 →
Integrated Circuit Package Substrate with High Density Routing Mechanism
Application:
10/164,495 →
Pbga Electrical Noise Isolation of Signal Traces
Application:
09/919,284 →
Ball Assignment for Ball Grid Array Package
Application:
09/844,530 →