Patent Assignment
Reel/Frame 023546/0137
Change of Name
Recorded: 2009-11-19
Pages: 7
Assignor
LSI LOGIC CORPORATION
Executed: 2007-04-05
Assignee
LSI CORPORATION
1621 BARBER LANE, MS: D-105 LEGAL, MILPITAS, CALIFORNIA, 95035
Covered Properties
(14)
Semiconductor Device Assembly with Minimized Bond Finger Connections
Patent:
5,545,923 →
Application:
08/396,084 →
Process for Forming Metal Interconnect Structures for Use with Integrated Circuit Devices to Form Integrated Circuit Structures
Patent:
5,756,395 →
Application:
08/516,614 →
Multi-Layer Tab Tape Having Distinct Signal, Power and Ground Planes, Semiconductor Device Assembly Employing Same, Apparatus for and Method of Assembling Same
Patent:
5,854,085 →
Application:
08/638,898 →
Grid Array Device Package Including Advanced Heat Transfer Mechanisms
Patent:
6,008,536 →
Application:
08/880,784 →
System and Method for Forming a Grid Array Device Package Employing Electromagnetic Shielding
Patent:
5,866,943 →
Application:
08/881,111 →
Integrated Circuit Package Having Bond Fingers with Alternate Bonding Areas
Patent:
6,008,532 →
Application:
08/956,682 →
Low Cost Thermally Enhanced Flip Chip Bga
Patent:
6,201,301 →
Application:
09/010,414 →
Multiple Row Wire Bonding with Ball Bonds of Outer Bond Pads Bonded on the Leads
Patent:
6,329,278 →
Application:
09/476,958 →
Enhanced Laminate Flipchip Package Using a High Cte Heatspreader
Patent:
6,472,762 →
Application:
09/944,964 →
Active Trace Rerouting
Thermal and Mechanical Attachment of a Heatspreader to a Flip-Chip Integrated Circuit Structure Using Underfill
Patent:
6,673,708 →
Application:
10/397,065 →
Ball Assignment Schemes for Integrated Circuit Packages
Ball Grid Array Assignment
High Speed Interface Design
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 18, 1995
From: ROSTOKER, MICHAEL D.; KAPOOR, ASHOK K.
To: LSI LOGIC CORPORATION
Reel/Frame 007679/0386 →
Assignment of Assignor's Interest
Mar 31, 1997
From: RAAB, KURT R.; MCCORMICK, JOHN
To: LSI LOGIC CORPORATION
Reel/Frame 008427/0858 →
Assignment of Assignor's Interest
Jun 23, 1997
From: MERTOL, ATILA
To: LSI LOGIC CORPORATION
Reel/Frame 008816/0397 →
Assignment of Assignor's Interest
Jun 23, 1997
From: MERTOL, ATILA
To: LSI LOGIC CORPORATION
Reel/Frame 008667/0996 →
Assignment of Assignor's Interest
Oct 24, 1997
From: CARICHNER, KARLA Y.
To: LSI LOGIC CORPORATION
Reel/Frame 008806/0459 →
Assignment of Assignor's Interest
Jan 21, 1998
From: HOANG, LAN H.
To: LSI LOGIC CORPORATION
Reel/Frame 009032/0399 →
Assignment of Assignor's Interest
Jan 3, 2000
From: LOW, QWAI H.; RANGANATHAN, RAMASWAMY; TORCUATO, REY
To: LSI LOGIC CORPORATION
Reel/Frame 010495/0113 →
Assignment of Assignor's Interest
Aug 31, 2001
From: KUTLU, ZAFER S.
To: LSI LOGIC CORPORATION
Reel/Frame 012143/0317 →
Assignment of Assignor's Interest
May 24, 2002
From: MORA, LEONARD L.; AWUJOOLA, ABIOLA A.; HALL, JEFFREY A.
To: LSI LOGIC CORPORATION
Reel/Frame 012949/0184 →
Assignment of Assignor's Interest
Mar 25, 2003
From: BARBER, IVOR G.; KUTLU, ZAFER S.
To: LSI LOGIC CORPORATION
Reel/Frame 013903/0639 →
Assignment of Assignor's Interest
Dec 7, 2004
From: RAMAKRISHNAN, ARUN; GOVIND, ANAND
To: LSI LOGIC CORPORATION
Reel/Frame 016073/0458 →
Assignment of Assignor's Interest
May 5, 2005
From: HALL, JEFFREY A.; GHAHGHAHI, FARSHAD
To: LSI LOGIC CORPORATION
Reel/Frame 016538/0386 →
Merger
Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
Assignment of Assignor's Interest
Dec 12, 2008
From: BARBER, IVOR
To: LSI LOGIC CORPORATION
Reel/Frame 021965/0671 →
Assignment of Assignor's Interest
Jan 13, 2010
From: LSI LOGIC CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023778/0084 →
Assignment of Assignor's Interest
Jan 13, 2010
From: LSI LOGIC CORPORATION
To: TESSERA, INC.
Reel/Frame 023778/0177 →
Corrective Assignment to Correct the Assignor's Name. Document Previously Recorded at Reel 023778 Frame 0084
Feb 12, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023973/0941 →
Corrective Assignment to Correct the Assignor's Name, Previously Recorded on Reel 023778 Frame 0177.
Feb 24, 2010
From: LSI CORPORATION
To: TESSERA, INC.
Reel/Frame 023985/0861 →
Assignment of Assignor's Interest
Sep 8, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024953/0596 →
Assignment of Assignor's Interest
Sep 29, 2010
From: MILLER, LEAH M.; WINN, GREGORY S.
To: LSI LOGIC CORPORATION
Reel/Frame 025066/0010 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →