IP Library › Granted Patent US 6,673,708
Granted Patent Utility
US 6,673,708 · Confirmation No. 4275

THERMAL AND MECHANICAL ATTACHMENT OF A HEATSPREADER TO A FLIP-CHIP INTEGRATED CIRCUIT STRUCTURE USING UNDERFILL

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 Code Description Pages PDF
2020-06-11 OATH Oath or Declaration filed 262 View
2010-07-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-07-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-07-01 PA.. Power of Attorney 1 View
2010-07-01 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2010-07-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-10-20 IFEE Issue Fee Payment (PTO-85B) 3 View
2003-10-07 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2003-03-25 TRNA Transmittal of New Application 3 View
2003-03-25 SPEC Specification 13 View
2003-03-25 CLM Claims 4 View
2003-03-25 ABST Abstract 1 View
2003-03-25 DRW Drawings-only black and white line drawings 2 View
2003-03-25 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,673,708
App. No.
10/397,065
Filed
2003-03-25
Granted
2004-01-06
Art Unit
2822
PTA
0 days