Patent Assignment
Reel/Frame 023778/0177
Assignment of Assignor's Interest
Recorded: 2010-01-13
Pages: 4
Assignor
LSI LOGIC CORPORATION
Executed: 2009-12-17
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(6)
Grid Array Device Package Including Advanced Heat Transfer Mechanisms
Patent:
6,008,536 →
Application:
08/880,784 →
System and Method for Forming a Grid Array Device Package Employing Electromagnetic Shielding
Patent:
5,866,943 →
Application:
08/881,111 →
Integrated Circuit Package Having Bond Fingers with Alternate Bonding Areas
Patent:
6,008,532 →
Application:
08/956,682 →
Active Trace Rerouting
Thermal and Mechanical Attachment of a Heatspreader to a Flip-Chip Integrated Circuit Structure Using Underfill
Patent:
6,673,708 →
Application:
10/397,065 →
Ball Assignment Schemes for Integrated Circuit Packages
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 1997
From: MERTOL, ATILA
To: LSI LOGIC CORPORATION
Reel/Frame 008816/0397 →
Assignment of Assignor's Interest
Jun 23, 1997
From: MERTOL, ATILA
To: LSI LOGIC CORPORATION
Reel/Frame 008667/0996 →
Assignment of Assignor's Interest
Oct 24, 1997
From: CARICHNER, KARLA Y.
To: LSI LOGIC CORPORATION
Reel/Frame 008806/0459 →
Assignment of Assignor's Interest
May 24, 2002
From: MORA, LEONARD L.; AWUJOOLA, ABIOLA A.; HALL, JEFFREY A.
To: LSI LOGIC CORPORATION
Reel/Frame 012949/0184 →
Assignment of Assignor's Interest
Mar 25, 2003
From: BARBER, IVOR G.; KUTLU, ZAFER S.
To: LSI LOGIC CORPORATION
Reel/Frame 013903/0639 →
Assignment of Assignor's Interest
Dec 7, 2004
From: RAMAKRISHNAN, ARUN; GOVIND, ANAND
To: LSI LOGIC CORPORATION
Reel/Frame 016073/0458 →
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Corrective Assignment to Correct the Assignor's Name, Previously Recorded on Reel 023778 Frame 0177.
Feb 24, 2010
From: LSI CORPORATION
To: TESSERA, INC.
Reel/Frame 023985/0861 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →