Patent Assignment
Reel/Frame 013903/0639
Assignment of Assignor's Interest
Recorded: 2003-03-25
Pages: 3
Assignee
LSI LOGIC CORPORATION
1621 BARBER LANE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Thermal and Mechanical Attachment of a Heatspreader to a Flip-Chip Integrated Circuit Structure Using Underfill
Patent:
6,673,708 →
Application:
10/397,065 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Assignment of Assignor's Interest
Jan 13, 2010
From: LSI LOGIC CORPORATION
To: TESSERA, INC.
Reel/Frame 023778/0177 →
Corrective Assignment to Correct the Assignor's Name, Previously Recorded on Reel 023778 Frame 0177.
Feb 24, 2010
From: LSI CORPORATION
To: TESSERA, INC.
Reel/Frame 023985/0861 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →