IP Library Granted Patent US 6,590,292
Granted Patent Utility
US 6,590,292 · Confirmation No. 2896

THERMAL AND MECHANICAL ATTACHMENT OF A HEATSPREADER TO A FLIP-CHIP INTEGRATED CIRCUIT STRUCTURE USING UNDERFILL

Patented Case View Patent ↗
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Code Description Pages PDF
2001-06-01 TRNA Transmittal of New Application 3 View
2001-06-01 SPEC Specification 13 View
2001-06-01 CLM Claims 4 View
2001-06-01 ABST Abstract 1 View
2001-06-01 DRW Drawings-only black and white line drawings 2 View
2001-06-01 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,590,292
App. No.
09/872,327
Filed
2001-06-01
Granted
2003-07-08
Art Unit
2822
PTA
0 days