Patent Assignment
Reel/Frame 011875/0575
Assignment of Assignor's Interest
Recorded: 2001-06-01
Pages: 3
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Thermal and Mechanical Attachment of a Heatspreader to a Flip-Chip Integrated Circuit Structure Using Underfill
Patent:
6,590,292 →
Application:
09/872,327 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Change of Name
Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
Assignment of Assignor's Interest
Feb 20, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035058/0248 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement
Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →