Patent Assignment
Reel/Frame 023778/0084
Assignment of Assignor's Interest
Recorded: 2010-01-13
Pages: 4
Assignor
LSI LOGIC CORPORATION
Executed: 2009-12-17
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(6)
Semiconductor Device Assembly with Minimized Bond Finger Connections
Patent:
5,545,923 →
Application:
08/396,084 →
Low Cost Thermally Enhanced Flip Chip Bga
Patent:
6,201,301 →
Application:
09/010,414 →
Multiple Row Wire Bonding with Ball Bonds of Outer Bond Pads Bonded on the Leads
Patent:
6,329,278 →
Application:
09/476,958 →
Enhanced Laminate Flipchip Package Using a High Cte Heatspreader
Patent:
6,472,762 →
Application:
09/944,964 →
Ball Grid Array Assignment
High Speed Interface Design
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 21, 1998
From: HOANG, LAN H.
To: LSI LOGIC CORPORATION
Reel/Frame 009032/0399 →
Assignment of Assignor's Interest
Jan 3, 2000
From: LOW, QWAI H.; RANGANATHAN, RAMASWAMY; TORCUATO, REY
To: LSI LOGIC CORPORATION
Reel/Frame 010495/0113 →
Assignment of Assignor's Interest
Aug 31, 2001
From: KUTLU, ZAFER S.
To: LSI LOGIC CORPORATION
Reel/Frame 012143/0317 →
Assignment of Assignor's Interest
May 5, 2005
From: HALL, JEFFREY A.; GHAHGHAHI, FARSHAD
To: LSI LOGIC CORPORATION
Reel/Frame 016538/0386 →
Merger
Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
Assignment of Assignor's Interest
Dec 12, 2008
From: BARBER, IVOR
To: LSI LOGIC CORPORATION
Reel/Frame 021965/0671 →
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Corrective Assignment to Correct the Assignor's Name. Document Previously Recorded at Reel 023778 Frame 0084
Feb 12, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023973/0941 →
Assignment of Assignor's Interest
Sep 29, 2010
From: MILLER, LEAH M.; WINN, GREGORY S.
To: LSI LOGIC CORPORATION
Reel/Frame 025066/0010 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →