Patent Assignment
Reel/Frame 012143/0317
Assignment of Assignor's Interest
Recorded: 2001-08-31
Pages: 2
Assignor
KUTLU, ZAFER S.
Executed: 2001-08-31
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, M/S D-106, INTELLECTUAL PROPERTY LAW DEPARTMENT, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Enhanced Laminate Flipchip Package Using a High Cte Heatspreader
Patent:
6,472,762 →
Application:
09/944,964 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 19, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023546/0137 →
Assignment of Assignor's Interest
Jan 13, 2010
From: LSI LOGIC CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023778/0084 →
Corrective Assignment to Correct the Assignor's Name. Document Previously Recorded at Reel 023778 Frame 0084
Feb 12, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023973/0941 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →