Patent Assignment
Reel/Frame 007879/0686
Assignment of Assignor's Interest
Recorded: 1996-04-08
Pages: 3
Assignors
RICHARDS, JOHN G.
Executed: 1996-03-18
SANDER, WENDELL B.
Executed: 1996-03-18
RICHMOND, DONALD P. II
Executed: 1996-03-18
FLORES, HECTOR
Executed: 1996-03-18
Assignee
CHIPSCALE, INC.
576 CHARCOT AVENUE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Method for Making a Leadless Surface Mounted Device with Wrap-Around Flange Interface Contacts
Patent:
5,656,547 →
Application:
08/241,602 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 6, 1994
From: RICHARDS, JOHN G.; SANDER, WENDELL B.; RICHMOND, DONALD P., II; FLORES, HECTOR
To: MICRO TECHNOLOGY PARTNERS
Reel/Frame 007119/0687 →
Security Agreement
Jul 17, 2008
From: LECKRONE, DANIEL E.; CHIPSCALE, INC.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL P.
Reel/Frame 021243/0894 →
License
Mar 4, 2009
From: CHIPSCALE, INC.
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0281 →
Notice of Default
Oct 8, 2009
From: LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED; CHIPSCALE, INC.
To: MARCOUX, PHIL
Reel/Frame 023337/0813 →
Bill of Sale
Apr 22, 2010
From: CHIPSCALE, INC.; LECKRONE, DANIEL E.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL
Reel/Frame 024263/0933 →
Assignment of Assignor's Interest
Jun 21, 2012
From: MARCOUX, PHIL P.; LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED LLC; WAFER-LEVEL PACKAGING PORTFOLIO LLC
To: MARCOUX, PHIL P.
Reel/Frame 028417/0789 →
Assignment of Assignor's Interest
Sep 6, 2012
From: MARCOUX, PHIL
To: CHIP SYSTEMS INNOVATIONS, LLC
Reel/Frame 028911/0296 →