Patent Assignment
Reel/Frame 022343/0281
License
Recorded: 2009-03-04
Pages: 9
Assignor
CHIPSCALE, INC.
Executed: 2007-12-14
Assignee
TECHNOLOGY PROPERTIES LIMITED LLC
20400 STEVENS CREEK BLVD., FIFTH FLOOR, CUPERTINO, CALIFORNIA, 95014
Covered Properties
(20)
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,403,729 →
Application:
07/889,832 →
Electrical Apparatus with a Metallic Layer Coupled to a Lower Region of a Substrate and Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,280,194 →
Application:
07/940,763 →
Method for Making a Leadless Surface Mounted Device with Wrap-Around Flange Interface Contacts
Patent:
5,656,547 →
Application:
08/241,602 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,521,420 →
Application:
08/270,784 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,592,022 →
Application:
08/270,939 →
Method of Making a Semiconductor Device with a Metallic Layer Coupled to a Lower Region of a Substrate and Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,455,187 →
Application:
08/331,783 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,441,898 →
Application:
08/363,732 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,444,009 →
Application:
08/363,733 →
Semiconductor Fabrication with Contact Processing for Wrap-Around Flange Interface
Patent:
5,557,149 →
Application:
08/409,994 →
Electrical Apparatus with a Metallic Layer Coupled to a Lower Region of a Substrate and a Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,789,817 →
Application:
08/749,422 →
Wafer Fabrication of Die-Bottom Contacts for Electronic Devices
Patent:
5,910,687 →
Application:
08/788,762 →
Wafer Fabrication of Inside-Wrapped Contacts for Electronic Devices
Patent:
5,904,496 →
Application:
08/788,764 →
Integrated Passive Components and Package with Posts
Patent:
6,414,585 →
Application:
08/855,105 →
Electronic Component Package with Posts on the Active Side of the Substrate
Patent:
6,051,489 →
Application:
08/855,106 →
Resistor Fabrication
Patent:
6,121,119 →
Application:
08/865,357 →
Wafer Fabrication of Die Bottom Contacts for Electronic Devices
Patent:
6,221,751 →
Application:
09/105,504 →
Wafer Fabrication of Inside-Wrapped Contacts for Electronic Devices
Patent:
6,355,981 →
Application:
09/235,135 →
Integrated Passive Components and Package with Posts
Integrated Passive Components and Package with Posts
Integrated Passive Components and Package with Posts
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jul 27, 1992
From: RICHARDS, JOHN G.; FLORES, HECTOR; SANDER, WENDELL B.
To: M-PULSE MICROWAVE A CORP. OF CALIFORNIA
Reel/Frame 006190/0383 →
Assignment of Assignors Interest.
Dec 8, 1992
From: M-PULSE MICROWAVE, INC.
To: MICRO TECHNOLOGY PARTNERS
Reel/Frame 006332/0365 →
Assignment of Assignor's Interest
Sep 6, 1994
From: RICHARDS, JOHN G.; SANDER, WENDELL B.; RICHMOND, DONALD P., II; FLORES, HECTOR
To: MICRO TECHNOLOGY PARTNERS
Reel/Frame 007119/0687 →
Assignment of Assignor's Interest
Apr 8, 1996
From: RICHARDS, JOHN G.; SANDER, WENDELL B.; RICHMOND, DONALD P. II; FLORES, HECTOR
To: CHIPSCALE, INC.
Reel/Frame 007879/0686 →
Assignment of Assignor's Interest
Apr 22, 1996
From: MICRO TECHNOLOGY PARTNERS (A CALIFORNIA GENERAL PARTNERSHIP)
To: CHIPSCALE, INC.
Reel/Frame 007909/0001 →
Assignment of Assignor's Interest
Apr 25, 1996
From: MICRO TECHNOLOGIES PARTNERS, A CALIFORNIA GENERAL PARTNERSHIP
To: CHIHPSCALE, INC.
Reel/Frame 007909/0048 →
Assignment of Assignor's Interest
May 24, 1996
From: MICRO TECHNOLOGY PARTNERS (A CALIFORNIA GENERAL PARTNERSHIP)
To: CHIPSCALE, INC.
Reel/Frame 007978/0442 →
Assignment of Assignor's Interest
May 24, 1996
From: MICRO TECHNOLOGY PARTNERS
To: CHIPSCALE, INC.
Reel/Frame 007981/0655 →
Assignment of Assignor's Interest
Jul 14, 1997
From: CHEN, CHANGSHENG; MARCOUX, PHIL P.; SANDER, WENDELL B.; YOUNG, JAMES L.
To: CHIPSCALE, INC.
Reel/Frame 008596/0252 →
Assignment of Assignor's Interest
Jul 14, 1997
From: RICHARDS, JOHN G.; RICHMOND, DONALD P., III; SANDER, WENDELL B.
To: CHIPSCALE, INC.
Reel/Frame 008596/0269 →
Assignment of Assignor's Interest
Nov 26, 1997
From: MARCOUX, PHIL P.; YOUNG, JAMES L.; CHEN, CHANGSHENG
To: CHIPSCALE, INC.
Reel/Frame 008818/0667 →
Assignment of Assignor's Interest
Nov 26, 1997
From: YOUNG, JAMES L.; CHEN, CHANGSHENG
To: CHIPSCALE, INC.
Reel/Frame 008817/0463 →
Security Agreement
Apr 15, 2008
From: CHIPSCALE, INC.; LECKRONE, DANIEL E.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL
Reel/Frame 020794/0961 →
Security Agreement
Jul 17, 2008
From: LECKRONE, DANIEL E.; CHIPSCALE, INC.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL P.
Reel/Frame 021243/0894 →
Notice of Default
Oct 8, 2009
From: LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED; CHIPSCALE, INC.
To: MARCOUX, PHIL
Reel/Frame 023337/0813 →
Bill of Sale
Apr 22, 2010
From: CHIPSCALE, INC.; LECKRONE, DANIEL E.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL
Reel/Frame 024263/0933 →
Assignment of Assignor's Interest
Jun 21, 2012
From: MARCOUX, PHIL P.; LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED LLC; WAFER-LEVEL PACKAGING PORTFOLIO LLC
To: MARCOUX, PHIL P.
Reel/Frame 028417/0789 →
Assignment of Assignor's Interest
Sep 6, 2012
From: MARCOUX, PHIL
To: CHIP SYSTEMS INNOVATIONS, LLC
Reel/Frame 028911/0296 →