Patent Assignment
Reel/Frame 020794/0961
Security Agreement
Recorded: 2008-04-15
Pages: 12
Assignors
CHIPSCALE, INC.
Executed: 2007-12-14
LECKRONE, DANIEL E.
Executed: 2007-12-14
TECHNOLOGY PROPERTIES LIMITED
Executed: 2007-12-14
Assignee
MARCOUX, PHIL
335 CHATHAM WAY, MOUNTAIN VIEW, CALIFORNIA, 94040
Covered Properties
(2)
Wafer Fabrication of Die-Bottom Contacts for Electronic Devices
Patent:
5,910,687 →
Application:
08/788,762 →
Wafer Fabrication of Die Bottom Contacts for Electronic Devices
Patent:
6,221,751 →
Application:
09/105,504 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 1997
From: CHEN, CHANGSHENG; MARCOUX, PHIL P.; SANDER, WENDELL B.; YOUNG, JAMES L.
To: CHIPSCALE, INC.
Reel/Frame 008596/0252 →
License
Mar 4, 2009
From: CHIPSCALE, INC.
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0281 →
Notice of Default
Oct 8, 2009
From: LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED; CHIPSCALE, INC.
To: MARCOUX, PHIL
Reel/Frame 023337/0813 →
Bill of Sale
Apr 22, 2010
From: CHIPSCALE, INC.; LECKRONE, DANIEL E.; TECHNOLOGY PROPERTIES LIMITED
To: MARCOUX, PHIL
Reel/Frame 024263/0933 →
Assignment of Assignor's Interest
Jun 21, 2012
From: MARCOUX, PHIL P.; LECKRONE, DANIEL; TECHNOLOGY PROPERTIES LIMITED LLC; WAFER-LEVEL PACKAGING PORTFOLIO LLC
To: MARCOUX, PHIL P.
Reel/Frame 028417/0789 →
Assignment of Assignor's Interest
Sep 6, 2012
From: MARCOUX, PHIL
To: CHIP SYSTEMS INNOVATIONS, LLC
Reel/Frame 028911/0296 →