Patent Assignment
Reel/Frame 028911/0296
Assignment of Assignor's Interest
Recorded: 2012-09-06
Pages: 6
Assignor
MARCOUX, PHIL
Executed: 2012-08-31
Assignee
CHIP SYSTEMS INNOVATIONS, LLC
335 CHATHAM WAY, MOUNTAIN VIEW, CALIFORNIA, 94040-4471
Covered Properties
(22)
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,403,729 →
Application:
07/889,832 →
Electrical Apparatus with a Metallic Layer Coupled to a Lower Region of a Substrate and Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,280,194 →
Application:
07/940,763 →
Method for Making a Leadless Surface Mounted Device with Wrap-Around Flange Interface Contacts
Patent:
5,656,547 →
Application:
08/241,602 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,521,420 →
Application:
08/270,784 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,592,022 →
Application:
08/270,939 →
Method of Making a Semiconductor Device with a Metallic Layer Coupled to a Lower Region of a Substrate and Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,455,187 →
Application:
08/331,783 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,441,898 →
Application:
08/363,732 →
Fabricating a Semiconductor with an Insulative Coating
Patent:
5,444,009 →
Application:
08/363,733 →
Semiconductor Fabrication with Contact Processing for Wrap-Around Flange Interface
Patent:
5,557,149 →
Application:
08/409,994 →
Electrical Apparatus with a Metallic Layer Coupled to a Lower Region of a Substrate and a Metallic Layer Coupled to a Lower Region of a Semiconductor Device
Patent:
5,789,817 →
Application:
08/749,422 →
Wafer Fabrication of Die-Bottom Contacts for Electronic Devices
Patent:
5,910,687 →
Application:
08/788,762 →
Wafer Fabrication of Inside-Wrapped Contacts for Electronic Devices
Patent:
5,904,496 →
Application:
08/788,764 →
Integrated Passive Components and Package with Posts
Patent:
6,414,585 →
Application:
08/855,105 →
Electronic Component Package with Posts on the Active Side of the Substrate
Patent:
6,051,489 →
Application:
08/855,106 →
Resistor Fabrication
Patent:
6,121,119 →
Application:
08/865,357 →
Wafer Fabrication of Die Bottom Contacts for Electronic Devices
Patent:
6,221,751 →
Application:
09/105,504 →
Wafer Fabrication of Inside-Wrapped Contacts for Electronic Devices
Patent:
6,355,981 →
Application:
09/235,135 →
Integrated Passive Components and Package with Posts
Integrated Passive Components and Package with Posts
Integrated Passive Components and Package with Posts
Semiconductor with Bottom-Side Wrap-Around Flange Contact
Semiconductor with Bottom-Side Wrap-Around Flange Contact
Application:
12/874,412 →
Publication:
US 2010/0327448
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.