Patent Assignment
Reel/Frame 008387/0747
Assignment of Assignor's Interest
Recorded: 1997-02-11
Pages: 2
Assignors
MIYASAKA, MITSUTOSHI
Executed: 1997-01-10
KITAWADA, KIYOFUMI
Executed: 1997-01-16
MATSUO, MINORU
Executed: 1997-01-16
HIGASHI, SEIICHIRO
Executed: 1997-01-21
OZAWA, TOKUROH
Executed: 1997-01-21
TAKENAKA, SATOSHI
Executed: 1997-01-21
MATSUEDA, YOJIRO
Executed: 1997-01-21
NAKAZAWA, TAKASHI
Executed: 1997-01-16
OHSHIMA, HIROYUKI
Executed: 1997-01-20
INOUE, SATOSHI
Executed: 1997-01-21
Assignee
SEIKO EPSON CORPORATION
3-5 OWA 3-CHOME, SUWA-SHI, NAGANO-KEN, 392, JAPAN
Covered Property
(1)
Thin Film Semiconductor Device, Fabrication Method Thereof, Electronic Device and Its Fabrication Method
Patent:
5,834,827 →
Application:
08/748,835 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.