Patent Assignment
Reel/Frame 008395/0811
Assignment of Assignor's Interest
Recorded: 1997-02-19
Pages: 2
Assignee
NIPPON PRECISION CIRCUITS, INC.
6-21, KYOBASHI 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Comprising Bonding Pad of Barrier Metal, Silicide and Aluminum
Patent:
5,923,087 →
Application:
08/782,394 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.