Patent Assignment
Reel/Frame 008558/0389
Assignment of Assignor's Interest
Recorded: 1997-06-09
Pages: 4
Assignor
BULLINGTON, JAMES R.
Executed: 1997-04-30
Assignee
INTERGRAPH CORPORATION
ONE MADISON INDUSTRIAL PARK, HUNTSVILLE, ALABAMA, 35894
Covered Property
(1)
Removable Circuit Board with Ducted Cooling
Patent:
5,822,188 →
Application:
08/835,694 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Dec 16, 1999
From: INTEGRAPH CORPORATION
To: FOOTHILL CAPITAL CORPORATION
Reel/Frame 010425/0955 →
Assignment of Assignor's Interest
Sep 5, 2000
From: INTERGRAPH CORPORATION
To: 3DLABS
Reel/Frame 011122/0951 →
Security Agreement
Aug 3, 2001
From: 3DLABS INC., LTD., AND CERTAIN OF PARENT'S SUBSIDIARIES; 3DLABS INC., LTD.; 3DLABS (ALABAMA) INC.; 3DLABS, INC.
To: FOOTHILL CAPITAL CORPORATION
Reel/Frame 012043/0880 →
Release of Security Agreement
Feb 16, 2005
From: WELL FARGO FOOTHILL, INC., FORMERLY KNOWN AS FOOTHILL CAPITAL CORPORATION
To: 3DLABS (ALABAMA) INC.; 3DLABS INC., A CORP. OF DE; 3DLABS INC., LTD., A COMPANY ORGANIZED UNDER THE LAWS OF BERMUDA; 3DLABS LIMITED, A COMPANY ORGANIZED UNDER THE LAWS OF ENGLAND
Reel/Frame 015722/0752 →
Correction: Reel 011122 Frames 0951-0960
Nov 2, 2006
From: INTERGRAPH CORPORATION, A DELAWARE CORPORATION
To: 3DLABS, INC. LTD.
Reel/Frame 018480/0116 →
Change of Name
Apr 1, 2014
From: 3DLABS INC., LTD.
To: ZIILABS INC., LTD.
Reel/Frame 032588/0125 →