Patent Assignment
Reel/Frame 008631/0640
Assignment of Assignor's Interest
Recorded: 1997-07-02
Pages: 2
Assignee
SGS-THOMSON MICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Property
(1)
Solid State Fingerprint Sensor Packaging Apparatus and Method
Patent:
6,011,859 →
Application:
08/887,204 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 24, 2000
From: SGS-THOMSON MICROELECTRONICS, INC.
To: STMICROELECTRONICS, INC.
Reel/Frame 010621/0613 →
Assignment of Assignor's Interest
Mar 31, 2004
From: STMICROELECTRONICS, INC.; STMICROELECTRONICS N.V.
To: UPEK, INC.
Reel/Frame 014475/0851 →
Assignment of Assignor's Interest
Sep 21, 2011
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 026944/0942 →
Corrective Assignment to Correct the Assignment Document to Identify Upek, Inc. as a Delaware Corporation Previously Recorded on Reel 026944 Frame 0942. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Oct 3, 2012
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 029074/0347 →
Assignment of Assignor's Interest
Apr 30, 2015
From: AUTHENTEC, INC.
To: APPLE INC.
Reel/Frame 035552/0286 →