Patent Assignment
Reel/Frame 010621/0613
Change of Name
Recorded: 2000-01-24
Pages: 7
Assignor
SGS-THOMSON MICROELECTRONICS, INC.
Executed: 1998-05-19
Assignee
STMICROELECTRONICS, INC.
M/S 2346, 1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Properties
(32)
Active Hierarchical Bitline Memory Architecture
Patent:
5,986,914 →
Application:
08/475,421 →
Reducing the Memory Required for Decompression by Storing Compressed Information Using Dct Based Techniques
Patent:
6,028,635 →
Application:
08/759,166 →
Burn-In Stress Test Mode
Patent:
6,037,792 →
Application:
08/771,645 →
High Voltage Termination with Buried Field-Shaping Region
Patent:
6,011,298 →
Application:
08/775,632 →
Programming the Inductance of Read/Write Heads
Patent:
6,031,807 →
Application:
08/852,278 →
Short Circuit Protection Circuit for a Low-Side Driver Circuit
Patent:
6,008,972 →
Application:
08/854,667 →
Layout for Sram Structure
Patent:
6,005,296 →
Application:
08/865,641 →
Method of Forming Integrated Circuit Transistors Using Sacrificial Spacer
Patent:
6,022,782 →
Application:
08/866,895 →
Power Down Brake Latch Circuit for a Brushless Dc Motor
Patent:
6,005,359 →
Application:
08/874,868 →
Solid State Fingerprint Sensor Packaging Apparatus and Method
Patent:
6,011,859 →
Application:
08/887,204 →
Voltage Regulator Circuit
Patent:
6,031,363 →
Application:
08/921,864 →
Method and Circuit for Enabling Rapid Flux Reversal in the Coil of a Write Head Associated with a Computer Disk Drive, or the Like
Patent:
6,052,017 →
Application:
08/928,447 →
A Landing Pad Structure in an Integrated Circuit
Patent:
6,093,963 →
Application:
08/943,382 →
Method and Apparatus for Improved Transition from Pulse Width Modulation to Linear Control
Patent:
5,994,856 →
Application:
08/956,837 →
Integrated Released Beam Sensor for Sensing Acceleration and Associated Methods
Patent:
6,028,343 →
Application:
08/957,568 →
Surface Mountable Integrated Circuit Package with Detachable Module and Interposer
Patent:
5,994,774 →
Application:
08/960,947 →
Picture Memory Mapping to Minimize Memory Bandwidth in Compression and Decompression of Data Sequences
Patent:
6,028,612 →
Application:
08/972,917 →
Method of Forming Submicron Contacts and Vias in an Integrated Circuit
Patent:
6,033,980 →
Application:
08/978,382 →
Motor Control Circuit and Method with Digital Level Shifting
Patent:
6,064,174 →
Application:
08/978,547 →
Field Emission Display Fabrication Method
Patent:
6,004,181 →
Application:
08/980,465 →
Method of Retracting a Read and/or Write Head for Parking
Patent:
6,064,539 →
Application:
08/989,094 →
Method of Forming a Landing Pad Structure in an Integrated Circuit
Patent:
6,025,265 →
Application:
08/989,953 →
Electronic Speed Limit Notification System
Patent:
6,008,740 →
Application:
08/992,446 →
Oscillator Using a Time Constant Circuit Based on Cyclic Heating and Cooling
Patent:
5,994,971 →
Application:
08/995,192 →
Method of Forming an Integrated Circuit Having Spacer After Shallow Trench Fill and Integrated Circuit Formed Thereby
Patent:
6,022,788 →
Application:
08/996,457 →
Circuit and Method for Setting the Time Duration of a Write to a Memory Cell
Patent:
6,006,339 →
Application:
09/020,430 →
Integrated Circuit with Improved Electrostatic Discharge Protection Including Multi-Level Inductor
Patent:
6,034,400 →
Application:
09/030,149 →
Method of Forming an Integrated Circuit Device
Patent:
6,027,979 →
Application:
09/073,417 →
Circuit and Method for Reading a Memory Cell
Patent:
5,995,421 →
Application:
09/087,399 →
Stress Reduction for Flip Chip Package
Patent:
6,011,301 →
Application:
09/094,135 →
Method of Improving Photoresist Adhesion on a Dielectric Layer
Patent:
6,010,959 →
Application:
09/152,729 →
Esd Protection Circuits
Patent:
6,028,465 →
Application:
09/227,941 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 1996
From: OWEN, JEFFERSON EUGENE; BALAKRISHNAN, JEYENDRAN
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008349/0691 →
Assignment of Assignor's Interest
Dec 31, 1996
From: BLANCHARD, RICHARD A.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008363/0653 →
Assignment of Assignor's Interest
May 7, 1997
From: DE LA SOUJEOLE, AXEL ALEGRE
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008543/0192 →
Assignment of Assignor's Interest
Jun 13, 1997
From: BRAMBILLA, MASSIMILIANO; NGUYEN, CHINH DAC; LEE, EUGENE C.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008609/0367 →
Assignment of Assignor's Interest
Jul 2, 1997
From: KALNITSKY, ALEXANDER; KRAMER, ALAN H.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008631/0640 →
Assignment of Assignor's Interest
Oct 2, 1997
From: CHAN, TSIU CHIU
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008746/0604 →
Assignment of Assignor's Interest
Oct 20, 1997
From: SMITH, GREGORY CLIFFORD; SMITH, DANIEL KEITH
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008770/0101 →
Assignment of Assignor's Interest
Oct 23, 1997
From: MENEGOLI, PAOLO
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008866/0470 →
Assignment of Assignor's Interest
Oct 24, 1997
From: CHAN, TSIU CHIU; DESILVA, MELVIN JOSEPH
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008883/0682 →
Assignment of Assignor's Interest
Nov 18, 1997
From: BALAKRISHNAN, JEYENDRAN; OWEN, JEFFERSON E.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008893/0331 →
Assignment of Assignor's Interest
Dec 11, 1997
From: NULL, MICHAEL W.; CAROBOLANTE, FRANCESCO; SCHLAGER, KARL M.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008950/0821 →
Assignment of Assignor's Interest
Dec 15, 1997
From: SIEGEL, HARRY MICHAEL; HUNDT, MICHAEL JOSEPH; BOND, ROBERT H.
To: SGS-THOMSON MICROELECTRONIC, INC.
Reel/Frame 009034/0629 →
Assignment of Assignor's Interest
Dec 17, 1997
From: HOPKINS, THOMAS L.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008927/0757 →
Assignment of Assignor's Interest
Dec 22, 1997
From: EDWARDS, WILLIAM E.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008938/0691 →
Assignment of Assignor's Interest
Dec 23, 1997
From: GANDY, TODD; SAMPSON, RONALD; HODGES, ROBERT
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008949/0726 →
Assignment of Assignor's Interest
Mar 27, 1998
From: PIDUTTI, ALBINO; DE LA SOUJEOLE, AXEL A.; PAKRISWAMY, ELANGO
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 009055/0252 →
Change of Name
Mar 29, 1999
From: SGS-THOMSON MICROELECTRONICS, INC.
To: STMICROELECTRONICS, INC.
Reel/Frame 009847/0555 →
Assignment of Assignor's Interest
May 3, 1999
From: SZIEBERT, IMRE L.
To: STMICROELECTRONICS, INC.
Reel/Frame 009934/0906 →
Assignment of Assignor's Interest
Oct 8, 1999
From: MCCLURE, DAVID CHARLES
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 010303/0281 →
Assignment of Assignor's Interest
Mar 31, 2004
From: STMICROELECTRONICS, INC.; STMICROELECTRONICS N.V.
To: UPEK, INC.
Reel/Frame 014475/0851 →
Assignment of Assignor's Interest
Sep 21, 2011
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 026944/0942 →
Assignment of Assignor's Interest
Aug 30, 2012
From: STMICROELECTRONICS, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 028878/0106 →
Corrective Assignment to Correct the Assignment Document to Identify Upek, Inc. as a Delaware Corporation Previously Recorded on Reel 026944 Frame 0942. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Oct 3, 2012
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 029074/0347 →
Assignment of Assignor's Interest
Apr 30, 2015
From: AUTHENTEC, INC.
To: APPLE INC.
Reel/Frame 035552/0286 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →