Patent Assignment
Reel/Frame 009847/0555
Change of Name
Recorded: 1999-03-29
Pages: 7
Assignor
SGS-THOMSON MICROELECTRONICS, INC.
Executed: 1998-05-19
Assignee
STMICROELECTRONICS, INC.
M/S 2346, 1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Properties
(36)
Method of Forming a Dielectric in an Integrated Circuit
Patent:
5,927,992 →
Application:
08/251,781 →
Test Mode Control Circuit of an Integrated Circuit Device
Patent:
5,982,188 →
Application:
08/282,047 →
Method for Forming a Metal Contact
Patent:
5,930,673 →
Application:
08/418,122 →
Method for Reducing Reflectivity of a Metal Layer
Patent:
5,888,908 →
Application:
08/430,220 →
A Circuit for Limiting the Current in a Power Transistor
Patent:
5,955,915 →
Application:
08/600,535 →
Method of Forming a Landing Pad Structure in an Integrated Circuit
Patent:
5,894,160 →
Application:
08/725,621 →
Integrated Circuit Actively Biasing the Threshold Voltage of Transistors and Related Methods
Patent:
5,883,544 →
Application:
08/758,930 →
Method of Forming a Metal Contact to Landing Pad Structure in an Integrated Circuit
Patent:
5,914,518 →
Application:
08/759,759 →
Rendering an Audio-Visual Stream Synchronized by a Software Clock in a Personal Computer
Patent:
5,889,515 →
Application:
08/762,616 →
Narrow Isolation Oxide Process
Patent:
5,895,237 →
Application:
08/775,177 →
Integrated Circuit with Power Dissipation Control
Patent:
5,898,235 →
Application:
08/775,611 →
Programmable Pulse Width Modulation Circuit
Patent:
5,898,329 →
Application:
08/775,612 →
High Voltage Termination with Buried Field-Shaping Region
Patent:
6,011,298 →
Application:
08/775,632 →
Liquid-Level Gauge Driver Circuit
Patent:
5,887,479 →
Application:
08/775,642 →
Integrated Circuit with Improved Overvoltage Protection
Patent:
5,917,220 →
Application:
08/777,784 →
Method of Forming a Landing Pad Structure in an Integrated Circuit
Patent:
5,909,636 →
Application:
08/802,811 →
Dmos Transistors with Schottky Diode Body Structure
Patent:
5,925,910 →
Application:
08/825,139 →
Clock Pulse Extender Mode for Clocked Memory Devices Having Precharged Data Paths
Patent:
5,917,353 →
Application:
08/848,342 →
Low Power Temperature Compensated, Current Source and Associated Method
Patent:
5,883,507 →
Application:
08/853,764 →
Multiple Transistor Dynamic Random Access Memory Array Architecture with Simultaneous Refresh of Multiple Memory Cells During a Read Operation
Patent:
5,881,010 →
Application:
08/856,972 →
Current Inhibiting I/O Buffer Having 5 Volt Tolerant Input and Method of Inhibiting Current
Patent:
5,969,541 →
Application:
08/858,867 →
Integrated Circuit Having Selective Bias of Transistors for Low Voltage and Low Standby Current and Related Methods
Patent:
5,929,695 →
Application:
08/867,538 →
Method of Making a Merged Device with Aligned Trench Fet and Buried Emitter Patterns
Patent:
5,960,277 →
Application:
08/868,525 →
Configurable Probe Pads to Facilitate Parallel Testing of Integrated Curcuit Devices
Patent:
5,896,039 →
Application:
08/878,613 →
Configurable Probe Pads to Facilitate Parallel Testing of Integrated Circuit Devices
Patent:
5,896,040 →
Application:
08/880,100 →
Testing of Embedded Memory by Coupling the Memory to Input/Output Pads Using Switches
Patent:
5,889,713 →
Application:
08/891,284 →
Low -Profile Removable Ball-Grid-Array Integrated Circuit Package
Patent:
5,950,072 →
Application:
08/900,674 →
Reset Circuit Using Comparator with Built-in Hysteresis
Patent:
5,880,611 →
Application:
08/901,034 →
Method of Making Eeprom Cell Structure
Patent:
5,885,871 →
Application:
08/903,608 →
Device and Method for Driving a Conductive Path with a Signal
Patent:
5,883,838 →
Application:
08/929,987 →
Method and Structure for Recovering Smaller Density Memories from Larger Density Memories
Patent:
5,905,683 →
Application:
08/940,045 →
Integrated Released Beam, Thermo-Mechanical Sensor for Sensing Temperature Variations and Associated Methods
Patent:
5,917,226 →
Application:
08/957,802 →
Programmed Memory with Improved Speed and Power Consumption
Patent:
5,940,332 →
Application:
08/969,890 →
Device and Method for Driving a Conductive Path with a Signal
Patent:
5,896,336 →
Application:
08/974,747 →
Integrated Circuit Die Suitable for Wafer-Level Testing and Method for Forming the Same
Patent:
5,883,008 →
Application:
08/979,019 →
Dc-To-Dc Converter with Soft-Start Error Amplifier and Associated Method
Patent:
5,917,313 →
Application:
08/994,923 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 31, 1994
From: HODGES, ROBERT L.; BRYANT, FRANK R.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 007059/0659 →
Assignment of Assignor's Interest
Jul 29, 1994
From: LYSINGER, MARK ALAN
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 007088/0717 →
Assignment of Assignor's Interest
Dec 3, 1996
From: CHAN, TSIU CHIU; SO, JASON SIUCHEONG
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008343/0181 →
Assignment of Assignor's Interest
Dec 9, 1996
From: MCDADE, DARRYN D.; OWEN, JEFFERSON E.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008332/0504 →
Assignment of Assignor's Interest
Dec 31, 1996
From: CHAN, TSIU C.; SAGARWALA, PERVEZ H.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008393/0682 →
Assignment of Assignor's Interest
Dec 31, 1996
From: BLANCHARD, RICHARD A.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008363/0653 →
Assignment of Assignor's Interest
Dec 31, 1996
From: WAGGONER, CHARLES D.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008347/0499 →
Assignment of Assignor's Interest
Mar 20, 1997
From: HOPKINS, THOMAS L.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008409/0548 →
Assignment of Assignor's Interest
Mar 28, 1997
From: MENEGOLI, PAOLO
To: SGS-THOMSON MICROLECTRONICS, INC.
Reel/Frame 008700/0489 →
Assignment of Assignor's Interest
Mar 31, 1997
From: MCCLURE, DAVID C.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008549/0812 →
Assignment of Assignor's Interest
May 9, 1997
From: YIN, RONG
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008588/0745 →
Assignment of Assignor's Interest
May 19, 1997
From: WAGGONER, CHARLES D.
To: SGS-THOMPSON MICROELECTRONICS, INC.
Reel/Frame 008575/0986 →
Assignment of Assignor's Interest
Jun 2, 1997
From: CHAN, TSIU CHIU; SAGARWALA, PERVEZ HASSAN
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 008634/0571 →
Assignment of Assignor's Interest
Mar 30, 1998
From: SWANSON, DAVID F.
To: SGS-THOMSON MICROELECTRONICS, INC.
Reel/Frame 009057/0201 →
Change of Name
Jan 24, 2000
From: SGS-THOMSON MICROELECTRONICS, INC.
To: STMICROELECTRONICS, INC.
Reel/Frame 010621/0613 →
Assignment of Assignor's Interest
Jul 3, 2013
From: STMICROELECTRONICS, INC. (FORMERLY KNOWN AS SGS-THOMSON MICROELECTRONICS, INC.)
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030740/0481 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →