Patent Assignment
Reel/Frame 009475/0934
Assignment of Assignor's Interest
Recorded: 1998-09-21
Pages: 2
Assignor
HINZE, LEE R.
Executed: 1998-08-06
Assignee
DELCO ELECTRONICS CORPORATION
MAIL STOP D-32, ERC BUILDING, KOKOMO, INDIANA, 46904
Covered Property
(1)
Process for Structurally Securing Stick-Leaded Components to a Circuit Board
Patent:
6,012,223 →
Application:
09/127,290 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 5, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 016700/0623 →
Security Agreement
Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Release of Security Agreement
Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Assignment of Assignor's Interest
Jan 22, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045102/0409 →