Patent Assignment
Reel/Frame 010011/0304
Assignment of Assignor's Interest
Recorded: 1999-06-02
Pages: 2
Assignor
VAGANOV, VLADIMIR I.
Executed: 1999-02-26
Assignee
ECOTECH INTERNATIONAL
129 EL PORTON, LOS GATOS, CALIFORNIA, 95032
Covered Property
(1)
Methods for Wafer to Wafer Bonding Using Microstructures
Patent:
6,406,636 →
Application:
09/324,342 →
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 23, 2000
From: IC SENSORS, INC.
To: FIRST UNION NATIONAL BANK, AS AGENT
Reel/Frame 011284/0293 →
Assignment of Assignor's Interest
Feb 26, 2001
From: ECOTECH INTERNATIONAL
To: MEGASENSE
Reel/Frame 011581/0734 →
Release of Security Interest in Patents and Tradem
Mar 14, 2003
From: WACHOVIA BANK, NATIONAL ASSOCIATION
To: MEASUREMENTSPECIALTIES, INC.; IC SENSORS, INC.
Reel/Frame 013879/0721 →
Assignment of Assignor's Interest
Apr 8, 2004
From: MEGASENSE, INC.; RODERICK SEBASTIAAN; HOUT, IN'T; VAGANOV, VLADIMIR I.
To: APPLIED PHOTONIC PRODUCTS INCORPORATED
Reel/Frame 015191/0573 →
Security Agreement
Jan 24, 2005
From: MEASUREMENT SPECIALTIES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 016153/0714 →
Release of Security Interest
Aug 11, 2006
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 018087/0198 →
Security Agreement
Jun 1, 2010
From: MEASUREMENT SPECIALTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024463/0953 →
Release of Security Interest
Jun 3, 2010
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: MEASUREMENT SPECIALTIES, INC.; IC SENSORS, INC.; ELEKON INDUSTRIES USA, INC.; ENTRAN DEVICES LLC
Reel/Frame 024474/0377 →
Release of Patent Security Interest
Oct 30, 2014
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 034104/0256 →