IP Library › Assignment 018087/0198
Patent Assignment
Reel/Frame 018087/0198

Release of Security Interest

Recorded: 2006-08-11 Pages: 3
Assignor
Assignee
MEASUREMENT SPECIALTIES, INC.
1000 LUCAS WAY, HAMPTON, VIRGINIA, 23666
Covered Property (1)
Methods for Wafer to Wafer Bonding Using Microstructures
Patent: 6,406,636 →
Application: 09/324,342 →
Related Assignments (9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 2, 1999
From: VAGANOV, VLADIMIR I.
To: ECOTECH INTERNATIONAL
Reel/Frame 010011/0304 →
Security Interest Oct 23, 2000
From: IC SENSORS, INC.
To: FIRST UNION NATIONAL BANK, AS AGENT
Reel/Frame 011284/0293 →
Assignment of Assignor's Interest Feb 26, 2001
From: ECOTECH INTERNATIONAL
To: MEGASENSE
Reel/Frame 011581/0734 →
Release of Security Interest in Patents and Tradem Mar 14, 2003
From: WACHOVIA BANK, NATIONAL ASSOCIATION
To: MEASUREMENTSPECIALTIES, INC.; IC SENSORS, INC.
Reel/Frame 013879/0721 →
Assignment of Assignor's Interest Apr 8, 2004
From: MEGASENSE, INC.; RODERICK SEBASTIAAN; HOUT, IN'T; VAGANOV, VLADIMIR I.
To: APPLIED PHOTONIC PRODUCTS INCORPORATED
Reel/Frame 015191/0573 →
Security Agreement Jan 24, 2005
From: MEASUREMENT SPECIALTIES, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 016153/0714 →
Security Agreement Jun 1, 2010
From: MEASUREMENT SPECIALTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024463/0953 →
Release of Security Interest Jun 3, 2010
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: MEASUREMENT SPECIALTIES, INC.; IC SENSORS, INC.; ELEKON INDUSTRIES USA, INC.; ENTRAN DEVICES LLC
Reel/Frame 024474/0377 →
Release of Patent Security Interest Oct 30, 2014
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 034104/0256 →